Taiwan Semiconductor Manufacturing Company (TSMC) will break ground soon for the construction of Fab 15 at the Central Taiwan Science Park (CTSP), according to an invitation to the groundbreaking ceremony scheduled for July 16.
Fab 15 will be equipped for 40nm production, and be responsible for the development of 28nm and more advanced processes, company CEO and chairman Morris Chang revealed in April.
TSMC is also on track to expand advanced process capacity at its existing two 12-inch fabs. The company has revealed plans to kick off volume production at the Phase 5 facility at Fab 12 in the third quarter of 2010, and complete Phase 4 expansion at Fab 14 by the end of the year.
TSMC's total installed capacity will reach 11.24 million 8-inch equivalent wafers in 2010, topping the 10 million mark for the first time, market watchers have noted. Advanced process capacity at the foundry's 12-inch fabs are expected to contribute 50% to its total capacity for the year.
TSMC has budgeted US$4.8 billion in capex this year, but Chang was quoted in a recent report as saying the company is likely to revise upward the capex target.作者: 治病救人 时间: 2010-7-14 16:04
提示: 作者被禁止或删除 内容自动屏蔽作者: Edison 时间: 2010-7-14 17:44
wafer 总产量和先进制程产量还是不同的两回事情
你确认你能看明白我们在说什么？
真当自己是专业人士了。。。吐。。。
