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标题: 微软公开新版 XBOX 360 的 CPU+GPU 合体处理器——Vejle [打印本页]

作者: Edison 时间: 2010-8-24 20:03
标题: 微软公开新版 XBOX 360 的 CPU+GPU 合体处理器——Vejle
PALO ALTO-On Monday, Microsoft revealed new details of the system-on-a-chip (SOC) within the latest Xbox 360 with 250 Gbytes.
Released in June, the new Xbox 360 is functionally identical to previous-generation versions. But the new model integrates the CPU cores and GPU cores on the same chip, much like new processors like the Intel Core i3 and i5, and the upcoming Fusion APUs from rival AMD.

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The latest chip is fabricated on a 45-nm process, designed by Microsoft, but fabricated via IBM and its partners, explained Rune Jensen, an engineering manager at Microsoft. Jensen and his IBM counterpart, Bob Drehmel, made the presentation at the Hot Chips conference here.

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Perhaps the largest change to the architecture, besides the integration, was the elimination of the front-side bus. Instead, the new chip uses what the designer called a front-side bus replacement bus that maintains compatibility. I/O chips and physical-layer interfaces (PHYs) also had to be removed, Drehmel said.

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The other change that was made to the architecture was an emphasis on power consumption, critical to eliminating all but a single heat sink and fan, shifting the SOc to a single chip, and quieting the Xbox 360 down to a reasonable noise level.

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"One of our key design requirements was to optimize the power used," Jensen said. Microsoft and IBM used an adaptive power supply for the core logic, Historically they said, SRAMs have be the limiting factor. With separate power tracking for the SRAMs on the CPU and GPU, the system designers saved 31 percent in terms of power. An additional 12 percent of power was saved using in-system voltage calibration, compared to the previous generation. The total power savings was 43 percent, Jensen said.

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That, in turn, allowed the company to minimize the fan speed, they said.

作者: FontainebleauV 时间: 2010-8-24 20:12
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作者: binbin 时间: 2010-8-24 20:16
本帖最后由 binbin 于 2010-8-24 20:34 编辑

这个45nm芯片由IBM和某个"合作合作伙伴"共同开发,。

作者: CC9K 时间: 2010-8-24 20:22
那个10M eDRAM呢？

作者: 66666 时间: 2010-8-24 20:22
全部加在一起也才372M，下代游戏机估计光GPU晶体管都是这规模的4,5倍了，总之还是热

作者: Edison 时间: 2010-8-24 20:34

那个10M eDRAM呢？
CC9K 发表于 2010-8-24 20:22

都在同一个 die 上，见第一个幻灯片。

作者: 最弱的ID 时间: 2010-8-24 20:55
我了个去，IBM和AMD又出私生子了？

作者: 落音缤纷 时间: 2010-8-24 21:26
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作者: 什么？ 时间: 2010-8-24 22:35
45nm SOI工艺的GPU。。。

作者: 来力 时间: 2010-8-24 22:38
那么X360也变成单片机了？

作者: yukika 时间: 2010-8-24 22:42

都在同一个 die 上，见第一个幻灯片。
Edison 发表于 2010-8-24 20:34

没有，eDRAM依然是独立MCM
图上也如此

作者: 高斯 时间: 2010-8-24 22:52
这个是谁设计的了？

作者: FontainebleauV 时间: 2010-8-24 23:05
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作者: efficient3d 时间: 2010-8-25 08:41
PS3的Cell和RSX啥时才集成在一起？新版的360就是用这个芯片的吧

作者: lookatthere0 时间: 2010-8-25 09:38
围观下。。

作者: chenxiang 时间: 2010-8-25 09:42
机器都出来了

作者: 66666 时间: 2010-8-25 09:46

PS3的Cell和RSX啥时才集成在一起？新版的360就是用这个芯片的吧
efficient3d 发表于 2010-8-25 08:41

这个估计危险，PS3的CPU和GPU内存控制器就不一样，一个XDR另外是DDR3，如果整合到一起内存控制器这块要全部重新设计，很麻烦

作者: maomaolong1 时间: 2010-8-25 10:44
这样的x360应该可以入手了吧，应该不会有GPU虚焊导致的三红了

作者: seyenak 时间: 2010-8-25 11:54
说句实话，双65nm的360对三红的控制已经相当不错了，软黑没必要再拿三红说事，我大热天玩360不开空调，想玩多久玩多久
另外，我是全机种

作者: vironlee 时间: 2010-8-27 14:49

作者: feng_6630 时间: 2010-8-27 17:26
降低成本的好手段啊！

作者: zhj02002 时间: 2010-8-27 17:36
新版的造型极其YY，看的我好像买le ~

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