标题: Broadcom最新 BCM92070 内置蓝牙模块 V3.0 [打印本页] 作者: alan_08 时间: 2010-12-10 20:45 标题: Broadcom最新 BCM92070 内置蓝牙模块 V3.0 Broadcom最新 BCM92070 内置蓝牙模块 V3.0 HP备件号：496754-001 BCM2070 - Single-Chip Bluetooth? 3.0 HCI SolutionSingle-Chip Bluetooth? 3.0 HCI Solution The Broadcom BCM2070 is a monolithic, single-chip, stand-alone baseband processor with a high performance integrated 2.4-GHz RF transceiver. It is fully compliant with Bluetooth 3.0 and all prior standard features. Processed using advanced 65-nm LP CMOS technology, the BCM2070 offers an unmatched integrated solution with the smallest footprint and lowest cost of implementing a Bluetooth system.
The use of the advanced 65-nm process enables the BCM2070 to achieve Broadcom's smallest package size and lowest possible current consumption in all modes of operation. The BCM2070 has an architecture that has been designed to take advantage of the High Speed standard. Its superior integrated RF design enables much higher output power and lower input sensitivity, which makes the BCM2070 the ideal solution to support all Bluetooth modes. The built-in Class 1 PA, which is capable of transmitting +10 dBm output power, can be enabled with 2.5V power supply. Together with Broadcom's leading Packet Loss Concealment (PLC) technology, which reduces packet loss and bit error rates, the BCM2070 can effectively combat interference and reduce dropped connections that result from distance and physical obstructions. These translate directly into higher and more reliable throughput, greater link-range and superior audio performance. 博通(Broadcom)新推出一款单芯片[url=]蓝牙[/url](Bluetooth)2.1+EDR方案[url=]BCM2070[/url]，该组件采65nm CMOS制程与Broadcom SmartAudio音效与语音强化技术，过去，SmartAudio仅被运用在无线耳机上，现在则被用来改善手机的使用寿命和音频品质。