标题: Ivy Bridge to Offer 20% - 30% Performance Boost Over Sandy Bri [打印本页] 作者: PRAM 时间: 2011-2-5 10:44 标题: Ivy Bridge to Offer 20% - 30% Performance Boost Over Sandy Bri Performance of Intel Corp.’s latest Core i-series “Sandy Bridge” and improvements it brings over predecessors is rather impressive, which is why the company managed to sell over eight million of appropriate microprocessors in just several months of revenue shipments. The next-generation central processing units (CPUs) will bring further 20% - 30% of speed boost, according to a media report.
In general-purpose applications Ivy Bridge micro-architecture-based chips will boost performance by around 20% compared to Core i-series “Sandy Bridge” products; performance of integrated graphics core of Ivy Bridge will get 30% higher compared to the graphics engine of the latest microprocessors by Intel, according to VR-Zone web-site, which claims that it had seen documents with Intel’s internal performance estimates.
The Intel HD Graphics core of Ivy Bridge will not only feature higher performance (according to some sources, it will have 16 stream processing elements (up from 12 of SNB), some claim that it will have 24 stream processors), but will also support DirectX 11, HDMI 1.4 output and probably some other improvements.
It is expected that Ivy Bridge CPUs, which will be made using 22nm process technology, will have certain micro-architecture level enhancements along with clock-speed and some other methods to boost performance.
The first Ivy Bridge family chips are projected to use LGA1155 form-factor. Nonetheless, Intel is preparing code-named Panther Point chipset for the new microprocessors. It is unclear whether Ivy Bridge CPUs will be able to work on current mainboards for latest-generation chips.
For Intel, Ivy Bridge is not just a new microprocessor, but is the first step to the completely new approach to manufacturing. The company intends to upgrade four of its fabs to its leading-edge 22nm process technology, which will require additional investments along with improved demand towards high-performance central processing units.
频率也确实该提升一下了。 在3G多已经好多年了。作者: kingclerk 时间: 2011-2-5 19:01
提升工艺带来的帮助是,在增多核心数量的基础上保持功耗不变,也许就是8核心125w或者6核心95w,或者同样95w的四核心,默认频率3.5G以上,turbo频率4G以上。纯属猜测,欢迎拍砖作者: kaven 时间: 2011-2-5 21:58
不得不说,intel的工厂太厉害了,amd,台积电真是没得比作者: OPPY 时间: 2011-2-5 22:43
若以TDP上限130W推算的话,SNB的8核应该是领跑22NM的,而且可能初期只有一种型号,作为旗舰,就像当初的980X一样作者: lanyan3232 时间: 2011-2-6 02:02
提示: 作者被禁止或删除 内容自动屏蔽作者: aikesi 时间: 2011-2-6 19:03
制程的进步估计是最大的变化了作者: PRAM 时间: 2011-2-7 13:20
While Intel’s current Sandy Bridge lineup is haunted by the Cougar Point P67/H67 Chipset error, They’ve already planned to introduce the next line of CPU’s codenamed “Ivy Bridge” as early as this June. The New CPU’s as we already know would be based on a 22nm die and would probably show up at this Years Computex 2011 in Taipei.
The new Processors will feature DX11 instead of the older DX10.1 and OpenGL3 on the Sandy Bridge processors and would also increase the number of EU’s in the graphics sub-system upto 24. Being based on a similar architecture to Sandy Bridge means that it’ll still support DDR3 Dual Channel memory and support the LGA1155 socket.
作者: PRAM 时间: 2011-2-7 13:22
INTEL'S ROMLEY PLATFORM is set to launch sometime in the second half of this year and it will bring with it a world of confusion in the Xeon market space as Intel will be offering both LGA-1356 and LGA-2011 solutions to its partners. The main difference is that the LGA-1356 platform will support triple channel memory while the LGA-2011 platform will support quad channel memory, but it doesn't stop there.
The processors for the LGA-1356 platform are known as Sandy Bridge EN while the models for the LGA-2011 socket has the EP suffix and the EN models will inherit the current LGA-1366 platforms triple channel memory support with up to two DIMMs per channel. However, the EP models support quad channel memory with up to three DIMMs per slot and can as such support up to 192GB of RAM using 8GB DIMMs compared to 96GB for the EN models.
Both the EN and EP models support up to eight cores and 16 threads and each core can have as much as 2.5MB of L3 cache. The EN models are set to have a TDP of between 40 and 95W while the EP models start at 50W, but peaks out at the same 95W. The EN models will support up to 24 lanes of PCI Express 3.0 bandwidth per CPU/socket, while the EP models will support up to 40 lanes per CPU/socket. Both the EN and EP SKUs support an additional four lanes worth of PCI Express 2.0 bandwidth in a dual socket configuration.
We've already written about the Patsburg chipset, but we keep seeing support for an ONFi NAND flash memory interface, but so far we're short on any real details as to whether or not this will really be implemented. Not much has changed from earlier information we've seen on the Patsburg chipset. Intel is expecting the overall platform performance to be some 20 percent better than the previous generation, i.e. Nehalem on LGA-1366 which seems like a fairly small step up, although we presume this is on a like for like core count, as Ivy Bridge will be Intel's first native 8 core CPU. It's worth remembering that we'll be seeing a consumer version of this at some stage during the second half of this year as well, although what'll be interesting to see is how many cores Intel will use for its consumer oriented LGA-2011 platform 作者: fyso 时间: 2011-2-7 15:32
PRAM 发表于 2011-2-7 13:20
While Intel’s current Sandy Bridge lineup is haunted by the Cougar Point P67/H67 Chipset error, The ...