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3#

楼主 |
发表于 2008-11-10 13:01
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只看该作者
终于找到解释了
Thermal Specification: The thermal specification shown is the maximum case temperature at the maximum Thermal Design Power (TDP) value for that processor. It is measured at the geometric center on the topside of the processor integrated heat spreader. For processors without integrated heat spreaders such as mobile processors, the thermal specification is referred to as the junction temperature (Tj). The maximum junction temperature is defined by an activation of the processor Intel® Thermal Monitor. The Intel Thermal Monitor’s automatic mode is used to indicate that the maximum TJ has been reached.
看了下貌似是说额定功率运行下的最高接触面温度啊 E文不好 有没有哪位帮忙翻译下? |
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