Ivy Bridge to Offer 20% - 30% Performance Boost Over Sandy Bri

PRAM

Performance of Intel Corp.’s latest Core i-series “Sandy Bridge” and improvements it brings over predecessors is rather impressive, which is why the company managed to sell over eight million of appropriate microprocessors in just several months of revenue shipments. The next-generation central processing units (CPUs) will bring further 20% - 30% of speed boost, according to a media report.

In general-purpose applications Ivy Bridge micro-architecture-based chips will boost performance by around 20% compared to Core i-series “Sandy Bridge” products; performance of integrated graphics core of Ivy Bridge will get 30% higher compared to the graphics engine of the latest microprocessors by Intel, according to VR-Zone web-site, which claims that it had seen documents with Intel’s internal performance estimates.

The Intel HD Graphics core of Ivy Bridge will not only feature higher performance (according to some sources, it will have 16 stream processing elements (up from 12 of SNB), some claim that it will have 24 stream processors), but will also support DirectX 11, HDMI 1.4 output and probably some other improvements.

It is expected that Ivy Bridge CPUs, which will be made using 22nm process technology, will have certain micro-architecture level enhancements along with clock-speed and some other methods to boost performance.

The first Ivy Bridge family chips are projected to use LGA1155 form-factor. Nonetheless, Intel is preparing code-named Panther Point chipset for the new microprocessors. It is unclear whether Ivy Bridge CPUs will be able to work on current mainboards for latest-generation chips.

For Intel, Ivy Bridge is not just a new microprocessor, but is the first step to the completely new approach to manufacturing. The company intends to upgrade four of its fabs to its leading-edge 22nm process technology, which will require additional investments along with improved demand towards high-performance central processing units.

Intel did not comment on the news-story.

openlock

里面的GPU性能提高20-30%还差不多，DirectX 11, HDMI 1.4都OK。但是同构架，同频率，CPU性能不肯能到20-30%那么多，除非IB的L3多很多

fyso

文中说，英特尔的22纳米CPU将增强微架构级别的设计，通过提升频率等方式提高性能，22纳米CPU的生产，将首次全面采用新工艺生产，英特尔打算升级四座工厂到22纳米制程的制造，这需要额外的投资。看来首批22纳米CPU的价格绝对不会便宜了，而且新CPU频率的提升也许是令人惊叹的。

wowman

买不起SB的P民进来围观

disruptor

comparing with the buggy chipset?

liu8866543

fyso 发表于 2011-2-5 15:19
文中说，英特尔的22纳米CPU将增强微架构级别的设计，通过提升频率等方式提高性能，22纳米CPU的生产，将首次 ...

频率也确实该提升一下了。 在3G多已经好多年了。

kingclerk

提升工艺带来的帮助是，在增多核心数量的基础上保持功耗不变，也许就是8核心125w或者6核心95w，或者同样95w的四核心，默认频率3.5G以上，turbo频率4G以上。纯属猜测，欢迎拍砖

kaven

不得不说，intel的工厂太厉害了，amd，台积电真是没得比

OPPY

若以TDP上限130W推算的话，SNB的8核应该是领跑22NM的，而且可能初期只有一种型号，作为旗舰，就像当初的980X一样

aikesi

制程的进步估计是最大的变化了

PRAM

While Intel’s current Sandy Bridge lineup is haunted by the Cougar Point P67/H67 Chipset error, They’ve already planned to introduce the next line of CPU’s codenamed “Ivy Bridge” as early as this June. The New CPU’s as we already know would be based on a 22nm die and would probably show up at this Years Computex 2011 in Taipei.

The new Processors will feature DX11 instead of the older DX10.1 and OpenGL3 on the Sandy Bridge processors and would also increase the number of EU’s in the graphics sub-system upto 24. Being based on a similar architecture to Sandy Bridge means that it’ll still support DDR3 Dual Channel memory and support the LGA1155 socket.

PRAM

INTEL'S ROMLEY PLATFORM is set to launch sometime in the second half of this year and it will bring with it a world of confusion in the Xeon market space as Intel will be offering both LGA-1356 and LGA-2011 solutions to its partners. The main difference is that the LGA-1356 platform will support triple channel memory while the LGA-2011 platform will support quad channel memory, but it doesn't stop there.

The processors for the LGA-1356 platform are known as Sandy Bridge EN while the models for the LGA-2011 socket has the EP suffix and the EN models will inherit the current LGA-1366 platforms triple channel memory support with up to two DIMMs per channel. However, the EP models support quad channel memory with up to three DIMMs per slot and can as such support up to 192GB of RAM using 8GB DIMMs compared to 96GB for the EN models.

Both the EN and EP models support up to eight cores and 16 threads and each core can have as much as 2.5MB of L3 cache. The EN models are set to have a TDP of between 40 and 95W while the EP models start at 50W, but peaks out at the same 95W. The EN models will support up to 24 lanes of PCI Express 3.0 bandwidth per CPU/socket, while the EP models will support up to 40 lanes per CPU/socket. Both the EN and EP SKUs support an additional four lanes worth of PCI Express 2.0 bandwidth in a dual socket configuration.

We've already written about the Patsburg chipset, but we keep seeing support for an ONFi NAND flash memory interface, but so far we're short on any real details as to whether or not this will really be implemented. Not much has changed from earlier information we've seen on the Patsburg chipset. Intel is expecting the overall platform performance to be some 20 percent better than the previous generation, i.e. Nehalem on LGA-1366 which seems like a fairly small step up, although we presume this is on a like for like core count, as Ivy Bridge will be Intel's first native 8 core CPU. It's worth remembering that we'll be seeing a consumer version of this at some stage during the second half of this year as well, although what'll be interesting to see is how many cores Intel will use for its consumer oriented LGA-2011 platform

fyso

PRAM 发表于 2011-2-7 13:20
While Intel’s current Sandy Bridge lineup is haunted by the Cougar Point P67/H67 Chipset error, The ...

INTEL目前的产品线Sandy Bridge正经受P67、H67芯片组出错的困扰，为此INTEL已经决定，最早将于今年6月份发布下一代产品 “Ivy Bridge”，新产品采用22纳米技术，并于今年的2011台北Computex大会上展示。

Ivy Bridge采用与Sandy Bridge相似的架构，并且都支持双通道DDR3和LGA1155，Ivy Bridge的显卡将有所提升，支持DX11，处理单元增加到24个。