未来AMD可能向TSMC移植技术来生产ATI GPU

单晶硅传奇

虽然AMD的工艺能帮助生产更好的GPU，但是受于产能限制，AMD显然不可能自己大规模生产GPU，而另一种可能性是，AMD就像通过向特许半导体移植技术来代工自己的CPU一样，很可能会向TSMC的部分生产线移植自己的技术，这样就能一举两得，既能让自己的工艺来生产GPU，又不会影响自身的产能，作为回报，TSMC可以将这些技术用于其他芯片的生产（就像特许那样），而AMD也可以借此获得价格优惠的代工订单

ayanamei

CPU不会拿给代工的

fengpc

cpu就是Intel的没有代工的
K7也有TSMC做的

lilun0080

amd的技术是基于soi的，怎么向tsmc移植技术啊。

AFXIF

AMD也有不基于SOI的90纳米技术
D制程的K8就是这批的，功耗似乎比E制程还低，只是频率上不去

Edison

按照TSMC之前的说法，他们的客户没有需要SOI来生产的需求。

http://www.fabtech.org/content/view/1698/2/

TSMC has no customer demand for SOI technology  Print   E-mail  
Friday, 28 July 2006  
Dr. Jack Sun, Vice President, Research & Development of TSMC retorted sharply with a "no" to a question from a financial analyst during a conference call covering Q2 financial results when asked about growing demand for power management technology, had customers begun design developments on SOI wafers, considering TSMC has taken out a license for the technology from Soitec.
The "no" was quickly followed up with an explanation that SOI wafers are "still too expensive and there are alternatives and the design barrier is quite high, as you know, SOI so far has been pretty in the niche market," explained Sun. "Most of the market cannot take that risk or cannot afford that kind of investment."

However ‘niche' SOI technology is it would seem to be a fast growing niche with the next generation gaming consoles microprocessors all aligned on the technology, pushing units into the double digit millions by the end of 2007. Then there is AMD, with over a 100 million MPUs shipped on the technology as well as decent numbers from IBM for many years. Some communications chips are also switching to the technology and the likes for Freescale, Infineon and NEC use SOI for specific device applications.

Chartered Semiconductor's Fab 7 is a 300mm fab currently dedicated to SOI device fabrication and is ramping past 10,000wspm this year. The pure-play foundry has four or more customers using Fab 7 for SOI devices.

Soitec the dominant supplier of bonded SOI wafers has seen significant growth in demand for the technology and announced in July 06 that it would expand wafer production near-term to 1 million wafers per year. Also to reiterate the growing demand it would build a new facility in Singapore that would double wafer production to 2 million wafers per annum.

Soitec is not alone in ramping SOI wafer production. SUMCO of Japan is using SIMOX SOI technology rather than the bonded technique pioneered by Soitec. Although volumes have been low due to the development cycles deemed necessary for high quality wafers with its tool partner Ibis, that period may be coming to a close and multiple tool orders placed to boost SOI production for customers primarily in Japan.

In a recently published (May 06) report by Semico Research SOI was not found to more expensive than bulk CMOS.


"On a straight manufacturing cost basis, the 10-15% SOI cost-of-ownership (COO) figure does not tell the whole story," said Joanne Itow, Managing Director of Manufacturing at Semico. "Moving further into the semiconductor manufacturing process, looking at the cost of SOI once the wafer is tested, diced and the good die packaged, the Semico analysis has found the SOI COO adds only 4-6% to the total manufacturing cost."


A key factor noted in the study by Itow was that SOI needed less on-die memory than bulk silicon devices, enabling real die shrinkage to occur. More importantly, according to Itow was the use of SOI in on die memory optimization could give a cost saving of up to 40 percent, dependent on what type of device it was.