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K4XXXXXXXX-XXXXXXX
1. Memory (K)
2. DRAM : 4
3. Small Classification
D : GDDR SDRAM
N : GDDR2 SDRAM
J : GDDR3 SDRAM
U : GDDR4 SDRAM
4~5. Density,Refresh
26 : 128M, 4K/32ms 28 : 128M, 4K/64ms
51 : 512M, 8K/64ms 52 : 512M, 8K/32ms
54 : 256M, 16K/16ms 55 : 256M, 4K/32ms
56 : 256M, 8K/64ms 62 : 64M, 2K/16ms
64 : 64M, 4K/64ms
6~7. Organization
16 : x16 32 : x32
8. Bank
2 : 2Bank 3 : 4Bank
4 : 8Bank
9. Interface, VDD, VDDQ
2 : LVTTL, 3.3V, 3.3V
4 : LVTTL, 2.5V, 2.5V
5 : SSTL2, 1.8V, 1.8V, LP
6 : SSTL2, 1.5V, 1.5V
8 : SSTL2, 2.5V, 2.5V
A : SSTL2, 2.5V, 1.8V
H : SSTL2, 3.3V, 2.5V
Q : SSTL2, 1.8V, 1.8V
R : SSTL2, 2.8V, 2.8V
10. Generation
M : 1st Generation A : 2nd Generation
B : 3rd Generation C : 4th Generation
E : 5th Generation F : 7th Generation
G : 8th Generation H : 9th Generation
I : 10th Generation K : 12th Generation
11."─“
12.Package
Q : TQFP
U : TQFP ( Lead Free )
G : 84/144ball FBGA
Z : 84ball FBGA ( Lead Free)
V : 144ball FBGA ( Lead Free )
A : 136ball FBGA
B : 136ball FBGA( Lead Free)
T : TSOP
L : TSOP ( Lead Free )
J : FBGA ( DDP )
E : FBGA ( DDP, Lead Free )
13. Temp, Power
C : Commercial Normal
L : Commercial Low
14~15. Speed ( Wafer/Chip Biz/BGD : 00 )
07 : 0.7ns ( 1400MHz )
08 : 0.9ns ( 1200MHz ) 1A : 1.0ns ( 1000MHz )
11 : 1.1ns ( 900MHz )
12 : 1.25ns ( 800MHz )
14 : 1.429ns ( 700MHz )
16 : 1.667ns ( 600MHz )
18 : 1.818ns ( 550MHz )
20 : 2.0ns ( 500MHz )
22 : 2.2ns ( 450MHz )
25 : 2.5ns ( 400MHz ) 2A : 2.86ns ( 350MHz ) 2C : 2.66ns ( 375MHz )
33 : 3.3ns ( 300MHz )
36 : 3.6ns ( 275MHz )
40 : 4ns ( 250MHz )
45 : 4.5ns ( 222MHz ) 50/5A : 5ns ( 200MHz )
55 : 5.5ns ( 183MHz )
60 : 6ns ( 166MHz )
16. Packing "Packing Type Reference"
-Common to all products, except of Mask ROM
-Divided into TAPE & REEL(In Mask ROM, divided into TRAY, AMMO Packing Separately)
Divide Packing Type New Marking
TAPE & REEL T
Component Other ( Tray, Tube, Jar ) 0 ( Number)
Stack S
Component TRAY Y
( Mask ROM ) AMMO PACKING A
Module MODULE TAPE & REEL P
MODULE Other Packing M
17~18. Customer "Customer List Reference" |
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