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楼主: itany
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INQ指NV的芯片组也出现严重缺陷

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jackpeng33 该用户已被删除
41#
发表于 2008-9-24 01:38 | 只看该作者
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jackpeng33 该用户已被删除
42#
发表于 2008-9-24 01:51 | 只看该作者
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43#
发表于 2008-9-24 03:14 | 只看该作者
原帖由 westlee 于 2008-9-23 08:18 发表


这篇报道里面没有提到650i。

我的帖子貌似是就前面网友所说的没有见NV芯片大面积故障说说自己的感受
对了,说到NF4,我有个朋友在本地一家维修公司,据他说,华硕的NF4主板芯片挂了的很多,他自己的也挂了,技嘉的NF4很多芯片虚焊,我另一个朋友的GA NF4就是芯片虚焊以后SATA接口失灵
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44#
发表于 2008-9-24 03:16 | 只看该作者
原帖由 iamadao 于 2008-9-23 20:40 发表


我也帮很多人配了XFX 4MOS版650I,我自己也是这块,使用效果都很好,也有好几个月了,没一块有问题的,还都很能超

只能说我RP大爆发了,今天给JD电话,请他们这次发板前先点一下,即使是旧的也无所谓,答曰不可试...
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45#
发表于 2008-9-24 05:27 | 只看该作者
大奶和二奶都是650i,年初帮别人配2块c68,3年前朋友的NF4一直OC至今

芯片组除了i就是n,另外的全是渣

2160+650i+4850+神条=爽翻了
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46#
发表于 2008-9-24 08:22 | 只看该作者
有问题又怎样?这种规模的公司永远不出问题,可能吗?intel的P1就出过问题,其他就不说了,结果又怎样?
我用过的NV的DD不多,N年前的帝盟的TNT 8M,小影霸的TNT2 32M,现在收藏了。05年的DFI LP NF4 UD到现在都好得很。
NV的DD不会死,只会慢慢消失。
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47#
发表于 2008-9-24 22:38 | 只看该作者

Fabless business model \'stressed out,\' says analyst

EE Times:

Fabless business model 'stressed out,' says analyst
Nvidia reportedly not getting enough 55-nm capacity from TSMC




http://www.eetimes.com/showArticle.jhtml?articleID=210601146


  

Dylan McGrath
EE Times
(09/11/2008 3:27 H EDT)


SAN FRANCISO—Nvidia Corp. is not getting the 55-nm capacity it needs from silicon foundry giant Taiwan Semiconductor Manufacturing Co. (TSMC), a problem likely to worsen as the graphics chip maker moves to the 40-nm node, according to Doug Freedman, an analyst at American Technology Research.
In a report published Thursday (Sept. 11), Freedman wrote that the "fabless business model seems to be getting stressed out" and that the Nvidia-TSMC relationship "sounds problematic" and "needs to evolve."

In order to minimize its own risk, TSMC is building less capacity as it ramps new technology nodes, according to Freedman. TSMC doesn't get enough visibility from its smaller customers such as Xilinx Inc., Altera Corp. and Broadcom Corp., Freedman wrote, so the foundry cannot take the risk of building new capacity to support larger customers. Nvidia is TSMC's largest customer, he noted.

TSMC's board of directors last month approved a $795 million capital spending plan that includes a push into 45-/40-nm CMOS processes and MEMS.

Last month, Nvidia reported second quarter financial results which included a charge of $196 million to cover a recall of faulty chips. An Nvidia spokesman initially blamed TSMC for the recall, due to a ''weak die/packaging material'' in select devices. The spokesman later recanted, saying Nvidia "worked closely with TSMC on packaging and the material.''

On Tuesday, a New York law firm said it filed a fraud class action lawsuit on behalf of Nvidia investors accusing Nvidia of failing to disclose "unusually high failure rates" or mobile video adapters. The suit, brought by Shalov Stone Bonner & Rocco LLP, names Nvidia, CEO Jen-Hsun Huang and Chief Financial Officer Marvin Burkett and alleges that they issued a series of misrepresentations and omissions relating to the failure rates of the recalled chips.

According to Freedman's report, none of the chips shipped by Nvidia were bad. Some chips were being run at cycle times that were too high for notebooks which led to packages cracking, Freedman said. According to Freedman, the parts Nvidia was shipping were good, but being run in the wrong notebooks.

Freedman also said Nvidia underestimated Advanced Micro Devices Inc.'s latest graphics chip offerings, including the price and performance. Nvidia cut its own prices to stop market share loss, which appears to be working, Freedman wrote.

Last week, Tristan Gerra, an analyst with financial management company Robert W. Baird & Co., said TSMC is seeing orders down substantially in the fourth quarter and could see its manufacturing utilization rates drop to their lowest percentage in five years. Last month, Mehdi Hosseini, an analyst with Friedman Billings Ramsey & Co. Inc., cut his forecast for TSMC due to lower-than-expected demand from foundry customers.
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48#
发表于 2008-9-25 17:37 | 只看该作者
用过NF2 IGP 芯片主板的苦主。。。从此对有设计考虑不足的N板异常小心
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Bohr 该用户已被删除
49#
发表于 2008-9-25 19:42 | 只看该作者
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