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EE Times: Semi News
TSMC confirms 40-nm yield issues, gives predictions
Mark LaPedus
Page 1 of 2
EE Times
(04/30/2009 4:20 PM EDT)
SAN JOSE, Calif. -- Silicon foundry giant Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC) posted better-than-expect results in the first quarter of 2009.
During a conference call with analysts, Rick Tsai, president and chief executive of TSMC (Hsinchu, Taiwan), acknowledged that the company had some ''yield'' issues with its new 40-nm process. He also provided some predictions for 2009.
Last year, TSMC rolled out its 40-nm process. In Q1 of 2009, the company's 40-nm process represented about 1 percent of its overall sales, which is better-than-expected. In Q2, TSMC expects to have 2 percent of its overall sales in the 40-nm arena.
去年,TSMC推出他的40NM工艺。在2009年第一季度,这个公司的40NM工艺占了他整个销售额的1%,这比预期要好 在第二季度,TSMC预计40NM市场会占到2%
When an analyst asked about yield problems with the company's 40-nm process, Tsai said: ''There have been difficulties with the yields. 40-nm is a difficult technology to manufacturer. We understand the root of the problem.''
当分析师问到公司40NM工艺的生产问题,Tsai(管他是谁。。。)说:“生产中曾经有着困难。对生产者来说,40NM工艺是一个困难的工艺。我们也明白问题的本质."
The TSMC CEO said the company has or is fixing the problem, but he did not elaborate. He also said that TSMC has demonstrated a functional SRAM cell, based on its upcoming 28-nm process, which includes high-k and metal gates for the gate stack.
TSMC CEO说公司已经修订或者正在修订这些问题,但是他没有给详细说明
The 28-nm process will also include a second gate-stack option, based on more conventional silicon dioxide. As previously reported, TSMC is expected to move into 28-nm production in the first part of 2010.
最后一句,就像以前报道的那样,TSMC预计在2010年上半期开动28NM工艺的生产
IC世界,困难太多了。所以不要说见个困难就说”束手无策“ |
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