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coollab 发表于 2013-1-7 16:14 ![]()
大小不知道也,我看法是一些低频版本的芯片塞入手机问题还是不大的。
- NEW: die size is around 80mm^2, slightly bigger than Tegra 3 but on a much higher density process
- NEW: the shaders aren't unified, the majority are 20-bit pixel shader cores though. No idea on the ratio yet.
引用前页有位仁兄写的内容,貌似T3时代的核心面积就算小的,就是发热大,不知道这代如何 |
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