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续
Kingston金士顿:
HyperX PC2700 (2-2-2-5-1T) (KHX 2700) 最初版为Samsung TCB3、之后改用Winbond BH-6、CH-6、CH-5,芯片经过打磨
HyperX PC3000 (2-2-2-6-1T) (KHX 3000) 最初版为Samsung TCB3,、之后改用Winbond BH-5, some BH-6, CH-5, CH-6 (芯片可能经过打磨)
HyperX PC 3200 (旧版,不是AK2、K2或者A) (KHX 3200) Winbond BH-5
HyperX PC 3200K2 (2-2-2-6-1T) (KHX 3200K2) Winbond BH-5
HyperX PC 3200AK2 (2-3-2-6-1T) (KHX 3200AK2) --chip--> Winbond CH-5
HyperX PC 3200ULK2 (2-2-2-5-1T) (KHX 3200ULK2) Samsung TCCD
HyperX PC 3500 (SPD参数2-3-3-7 @ 433Mhz, 2-2-2-6 @ 400Mhz,旧版) (KHX 3500) Winbond BH-5 (芯片可能经过打磨)
HyperX PC 3500K2 (2-3-3-7) (KHX 3500K2) Winbond CH-5
HyperX PC 4000K2 (3-4-4- (KHX 4000K2) Samsung TCCC, Hynix D43, D5
HyperX PC 4300K2 (3-4-4- (KHX 4300K2) Hynix D5
Kingston芯片被打磨为D328DW-45 03年18周以前的产品Winbond BH-5、CH-5 (03年18周以后的产品两种芯片都有)
Kingston芯片被打磨为D328DW-5 Winbond BH-5
Kingston芯片被打磨为D328DW-6 Winbond BH-6
Kingston芯片被打磨为D328DM-6 应该是Winbond BH-6
Kingston芯片被打磨为D328DM-5 应该是Winbond BH-5
value Ram 333Mhz (2,5-3-3-*) (KVR333X64C25) 部分产品为Winbond BH-6, AH-6, Hynix D43, D5 (芯片可能经过打磨)
value Ram 400Mhz (2,5-3-3-*) (KVR400X64C25) 部分产品为Winbond BH-5, CH-5, Micron 46V32M8 -5B C, Hynix D43, D5, Samsung TCCC, TCC4(芯片可能经过打磨)
Mushkin:
PC2700 (不属于Level X系列, rated 2-3-3, Promo-Build) Winbond CH-6
PC3200 Cl2,5 (不是Level X、Blue、Green) Winbond BH-5, Samsung TCB3
PC3200 (不是Level X, rated 2-2-2, Promo-Build) Winbond BH-5
PC3200 Level I (2-3-2) Winbond CH-5
PC3200 Level II (2-2-2) Winbond BH-5或者BH-6
PC3200 Special 2-2-2 Winbond BH-6
PC3200 Level II V2 (2-2-2) Samsung TCCD
PC3500 Level I (2-3-3) Winbond CH-5
PC3500 Level II (2-2-2) Winbond BH-5
PC3200 BLUE CL2 DC (2-3-3-X) Winbond UTT -采用Brainpower PCB(新品)
PC3700 (2,5-4-3) Samsung TCCD (rev. F)
PC4400 (2,5-4-4) Samsung TCCD (rev. F) -采用Brainpower PCB
OCZ:
EL DDR PC3200 Gold Winbond新版BH5 -采用Brainpower PCB(新品)
EL DDR PC3200 Platinum Limited Edition (2-2-2-7) Winbond BH-6
EL DDR PC3200 Platinum Edition (2-3-2-5) Samsung TCB3、ProMOS 5ns(打磨), Mosel Vitelic 5ns(打磨), Winbond CH-5
EB DDR PC3200 Platinum Edition (2,5-3-2- Micron 46V32M8 -5B C
EL DDR PC3200 Platinum Edition rev2 (2-2-2-5) Samsung 4ns TCCD -采用Brainpower PCB
EL DDR PC3200 DC value VX (OCZ4001024WV3DC-K) (3-4-4-8 @2,6V) Windond UTT (被打磨为OCZ VX) -采用Brainpower PCB 808
EL DDR PC3200 DC Gold VX (2-3-3-8 @2.6V | 2-2-2-8 @3.2V) --chip--> Windond UTT (relabeled as OCZ Voltage eXtreme) ~ Brainpower PCB 808
EL DDR PC4000 DC Gold VX (2-2-2-8 @3.3V) --chip--> Windond UTT (relabeled as OCZ Voltage eXtreme) ~ Brainpower PCB 808(新品)
EL DDR PC3500 Platinum Limited Edition (2-2-3-6) Winbond BH-5
EL DDR PC3500 Platinum Edition (2-3-2-5) Winbond CH-5、少量BH-5
EB DDR PC3500 Platinum Edition (2,5-3-2- Micron 46V32M8 -5B C
EL DDR PC3700 Gold Edition rev1 (2-3-3-7) Samsung TCB3(打磨)
EL DDR PC3700 Gold Edition rev2 (2,5-3-3-7) ProMOS 5ns(打磨) , Mosel Vitelic 5ns (打磨)
EL DDR PC3700 Gold Edition rev3 (2,5-3-3- Hynix DT-D5 -采用Brainpower PCB 808
EB DDR PC3700 Platinum Edition (3-2-2-8/3-3-2- Micron 46V32M8 -5B C
DDR PC4000 (3-4-4- Hynix D5, D43 (打磨)
DDR PC4200 (3-4-4- Hynix D5, D43
DDR PC4400 (3-4-4- Hynix D5
EL DDR PC4400 Gold Edition (2,5-4-4- Hynix B, Samsung TCCD (新品)
EL PC4800 Platinum Edition (2,5-4-4-10 1T/2T @2,85V) Samsung TCCD(新版) -采用Brainpower PCB (新品)
OC-Wear:
OC-WearDDR PC3200 (2-3-3-6) - DDR560 CL 3-4-4-8 @ 2.8V Samsung TCCD -采用Brainpower PCB
Patriot: (不全)
Patriot PDC5123200+XBLKPDC1G3200+XBLK (2-2-2-5) Samsung TCCD -采用Brainpower PCB
PQI: (不全)
PQI Turbo Memory DC PC3200 (2-2-2-5) Samsung TCCD -采用Brainpower PCB
PQI Turbo Memory DC PC4000 (2,5-3-3-7) Samsung TCCD -采用Brainpower PCB
Samsung三星:
PC3200 Samsung TCC4, TCCC
PC3700 Samsung TCC5
PC4000 CL3 Samsung TCCD
Shikatronics:
ShikaXram PC4400 (3-4-4- Hynix B
SimpleTech:
Nitro PC4000 (3-4-4- Hynix D5 (新品)
Team Group:
ASTAK DDR600 PC4800 (3-4-4- Samsung TCCD -采用Brainpower PCB 808 (新品)
TwinMos勤茂:
Twinmos DDR333 (2,5-3-3-6) Samsung TCB3, TCC4、Winbond AH-6, Winbond BH-6, Twinmos, Hynix, Mtec
Twinmos/Winbond DDR400 (2,5-3-3-6) 可能是Winbond BH-5, CH-5
Twinmos Twisters DDR500 (TSOP封装) (3-4-4- Hynix D43, Samsung TCCC
Twinmos Twisters DDR533 (3-4-4- Hynix D5
TwisterPro PC3200/DDR400 (2-2-2-5) Samsung TCCD
TwisterPro PC3700/DDR466 (2,5-3-3-7) Samsung TCCD (新品)
Speed Premium PC3500 (DDR433) (2,5-3-3- Winbond新版BH-5
以下是Twinmos使用Winbond UTT内存颗粒的产品(被打磨为TwinmosM.Tec)
(*) Twinmos SpeedPremium (04年46周以后UTT & Brainpower PCB)
(*) Two Do(不是AADT、1A4T)
(*) Metal Dots (two in each side!)
(*) 44D (或50D) -请使用文明用语- marking (有些60D PC2700也是)
以下是Twinmos使用新版Winbond BH-5内存颗粒的产品(被打磨为TwinmosM.Tec) (新品)
(*) Twinmos SpeedPremium (04年46周以后BH-5 & Brainpower PCB)
(*) Two Dots marking
(*) 1A4T (不是AADT、AA4T)
(*) Metal Dots (two in each side!)
(*) 44D (或50D) -请使用文明用语- marking (有些60D PC2700也是)
Ultra:
Extreme Memory PC3200 DDR 400MHZ (2-2-2-5-1T) Winbond BH-5, 经过挑选的CH-5
注: 使用Brainpower PCB或者改良版JEDEC PCB的内存产品都作了标记,那是因为这种PCB比JEDEC公版的PCB拥有更好的电气性能以及高频下稳定工作的能力。一般来说相同内存颗粒使用改良版的JEDEC PCB或者Brainpower PCB的内存超频能力能够提高5/10MHz,当然对超频之后的稳定性也大有裨益!
[[i] 本帖最后由 INFONLINE 于 2005-7-25 22:31 编辑 [/i]] |
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