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[XF] P55近距離+全球首度曝光:華碩「P7P55 Pro」主機板; q# `6 Y7 }& g, @" W# [% q
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[XF] P55近距離+全球首度曝光:華碩「P7P55 Pro」主機板
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2 [: L" R8 N" X: m0 a' o[XF] Close Look on P55: ASUS "P7P55 PRO" hits the road
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& J! V% K X# l' u「P55」這個字眼,相信硬體玩家們應該都已經聽到、也看到了不少相關的資料了。在X58、LGA 1366平台大量曝光之後,Intel已經用了好幾年的LGA 775平台,也即將走到終點。雖然說P55只是Intel 5-Series Express Chipset家族中的成員之一,後續還有P57、H55、H57、Q55即將面試,但根據可靠消息來源指出,首批LGA 1156腳位的CPU將有5款會於09年9月進入市場,而內建顯示功能的LGA 1156腳位CPU,則是可能在2010年1月左右再釋出5款,在Intel的規劃下,玩家們一定不可不知接下來的硬體上的變化。今天Edward從華碩這邊取得了即將在Computex大會中展示的主機板:華碩ASUS P7P55 PRO,雖然硬體配置與配色的部份都還不是最終版本,量產前都還可能更改,不過相信大家都對P55主機板可能的規劃,一定都有不小的興趣吧?搶先為各位報導,請接著看下去吧!0 v! E' }6 I- |) ^# X
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We already heard lots of rumors about the Intel P55 Express Chipset and also can easily get data from Google. But after massive exposure on X58/LGA 1366, most of the HW Geeks pay attention on the LGA 775: is it time to change to LGA 1156? Although the P55 is the member in the Intel 5-Series Express Chipset family, we still have P57/H55/H57/Q55 chipset to meet later. According to the source, in Sept. 09, Intel will release the Lynnfield in 5 diffrent model, and then release 5 Havendale CPU in Jan. 10, so if you are a crazy HW Geek, you have to read more about this. Today Edward just got the lastest ASUS Mobo for the Computex 09: ASUS "P7P55 PRO", it is not a final version and the layout may change on formal release, but you should know the possible layout now, just reply and get the pics you want. :)9 E5 E$ a3 t2 @ \2 L2 M
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F$ P/ Z7 u& q6 G5 @* h% o9 o華碩ASUS P7P55 PRO 主機板,特別拍了一張大圖給各位看看。1 g* J& K+ Q, z5 ]( D
雖然還不是Final的版本,不過大致上看得出P55在主機板上可能的配置,以黑色+藍色為主要的配色。 v3 L1 d; h1 p5 v3 K g3 ]5 E
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ASUS P7P55 PRO MOBO, this is a big pic on it, the color mainly use the black + blue for all.
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以下內容 回復但請勿灌水 才能瀏覽 (Please reply to see more detail)2 o# p& [3 e! M, Y+ M V
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CPU周圍特寫,中間為LGA 1156腳座,為FOXCONN製作,採用日系高品質固態電容,銀灰色的外殼,相當少見;
5 h) L+ n$ _- ~$ r% u- xMOSFET部份則用不規則散熱片加上,看起來是11相電源供電,不過這邊不多做臆測。
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CPU Socket close look, LGA 1156 is in the middle by the FOXCONN, with lots of Japan-Cap and color in gray, rare seen before;) i8 X. r% P N3 E' D1 `
MOSFET comes with the irregualr heatsink, looks like 11 Phases, but I can not give more details on that.
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4 _- T6 d0 T! I; S% i/ W電容、電感部份近拍特寫。- q/ ~7 G$ b- A6 Q% _2 C# \
2 |" X. M; o* @) r9 U* }Close look on Cap and Choke.1 C/ b: R1 `; g# U/ l+ x
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( X6 N: v; r! {' |. D/ fLGA 1156腳位的開啟方式:首先推開拉柄,輕輕往上拉。
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9 H* r- E5 t9 ~1 X) g+ HNow show you the LGA 1156's design: pull out the handle.
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9 F& X: c+ H7 K; i* x& W+ t- t3 q拉柄往後,Socket蓋子就會慢慢升起。( x9 ]0 e: J0 t$ n
8 c: w$ E9 p+ {4 k0 ~6 eYou will see the socket is going up.4 }: s6 G/ Q( ~( A2 O; \( ~
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Socket採單邊固定設計,全部打開之後就可以安裝CPU了。
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We can install the CPU now...there is a small cap on it.5 X0 y; o# Y4 Q# [
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+ k* \/ E# N. F. xLGA 1156內部全貌,實際大小比LGA 1366小大約20%左右。$ z z; e1 }/ A
/ n0 \! G3 O( U. t+ r" ~Close look on LGA 1156, the size is about 80% of the LGA 1366.
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單邊固定的機制,目前Edward這邊還沒有時間測試,
; `7 w( d2 I+ c1 P不過看來Intel也有針對LGA 1366蓋子過於緊繃的問題加以修正。
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Single-Side installation, I still have no time to use the ES Lynnfield on it,, W# }+ z. F8 [: b O
but I believe Intel know the LGA 1366 problem: TOO TIGHT and HURT MY CPU !!
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記憶體插槽部份,採用4 DIMM DDR3 SLOT,這當然是因為LGA 1156支援雙通道DDR3而設計的。9 ?5 [& f1 A" s4 x
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4 DIMM DDR3 SLOT with Dual-Channel, it is not surprised, Lynnfield is not like the Bloomfield.* b3 N1 c& g2 ]# f& X, h0 O
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插槽部份採單邊固定設計,應該是未來記憶體插槽的主流了;
- P. U$ |! Y$ `0 t4 R' C% j/ n! v0 G這邊另外提供記憶體2相獨立供電。
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The DIMM Slot also comes with a single-side installation function/2 Phases here.7 s. _" j8 A+ Y" [. s, a% _/ B" [
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華碩ASUS P7P55 PRO的字樣。
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$ W) B! r( w, z% v. V9 fThe Logo of ASUS P7P55 PRO.
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. F; S2 a2 o2 M; |( M慢速週邊部份,IDE採90度轉折設計,SATA Port位置較低,故採用正常設計,沒有VGA干涉的問題;3 U: i( y1 _! v
IDE後方控制晶片為JMB363,晶片組周圍以白線框出一定範圍,未來定版時散熱片可能還會有所變化。
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Peripheral Part, IDE have a 90 degrees desgin for the VGA card issue,+ D2 A( B" l5 e* W
but the sata ports are lower than 2 PCI-E Slot, so it's not a big problem to design the SATA port like a normal on;
. g' a& T# G" `& x" t: ~( v' Q4 RThe chip behide the IDE is JMB363, you can also see the white line surrounded the chipset, the layout or heatsink may change on formal release." @% A; P9 ~9 M. _6 k) {3 i9 B G
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: E! L1 h+ U: {5 M+ {華碩ASUS P7P55 PRO提供2組PCI-E x16介面,中間卡了2組PCI-E x1介面,另有3組PCI插槽︰% d" T& s3 y! I
音效部份則是採用了VIA的Solution。3 e, Z4 q/ ^# |; F- z
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Provide 2* PCI-E x16 and 2*PCI-E x1 between them, and there are also 3 PCI Slot here, the sound part takes the VIA solution.
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) \ B% j5 z$ j/ B3 HP7P55的Rear Panel部份。連同主機板上的3組USB內接腳座,P55一次可支援14組USB 2.0裝置,這邊則另有IEEE 1394與e-SATA接頭。
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Rear Panel, P55 can support 14 USB2.0 device, and you can also see the IEEE 1394 6-pin and e-SATA here.
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拆下散熱片...看一下內部的情況是怎樣。
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Take out the heatsink and have a close look on P55...
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) D# r- p/ j1 p- Z9 X仍為ES版本的Ibex Peak單晶片Intel P55 Express Chipset
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+ J. I8 ]0 c9 K1 BIbex Peak single-chip: Intel P55 Express Chipset, ES version now.0 _5 |: t- o4 B; r0 T, i
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