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[XF] P55近距離+全球首度曝光:華碩「P7P55 Pro」主機板
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* G K" R% D! `0 i[XF] P55近距離+全球首度曝光:華碩「P7P55 Pro」主機板, A* W; X& [6 E) G7 T7 n
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[XF] Close Look on P55: ASUS "P7P55 PRO" hits the road
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/ `/ M e$ {' B& x# X「P55」這個字眼,相信硬體玩家們應該都已經聽到、也看到了不少相關的資料了。在X58、LGA 1366平台大量曝光之後,Intel已經用了好幾年的LGA 775平台,也即將走到終點。雖然說P55只是Intel 5-Series Express Chipset家族中的成員之一,後續還有P57、H55、H57、Q55即將面試,但根據可靠消息來源指出,首批LGA 1156腳位的CPU將有5款會於09年9月進入市場,而內建顯示功能的LGA 1156腳位CPU,則是可能在2010年1月左右再釋出5款,在Intel的規劃下,玩家們一定不可不知接下來的硬體上的變化。今天Edward從華碩這邊取得了即將在Computex大會中展示的主機板:華碩ASUS P7P55 PRO,雖然硬體配置與配色的部份都還不是最終版本,量產前都還可能更改,不過相信大家都對P55主機板可能的規劃,一定都有不小的興趣吧?搶先為各位報導,請接著看下去吧!
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We already heard lots of rumors about the Intel P55 Express Chipset and also can easily get data from Google. But after massive exposure on X58/LGA 1366, most of the HW Geeks pay attention on the LGA 775: is it time to change to LGA 1156? Although the P55 is the member in the Intel 5-Series Express Chipset family, we still have P57/H55/H57/Q55 chipset to meet later. According to the source, in Sept. 09, Intel will release the Lynnfield in 5 diffrent model, and then release 5 Havendale CPU in Jan. 10, so if you are a crazy HW Geek, you have to read more about this. Today Edward just got the lastest ASUS Mobo for the Computex 09: ASUS "P7P55 PRO", it is not a final version and the layout may change on formal release, but you should know the possible layout now, just reply and get the pics you want. :)* Y/ {( |/ u8 m) R }
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華碩ASUS P7P55 PRO 主機板,特別拍了一張大圖給各位看看。
- g6 ]: R$ t, e+ @4 f! X0 _" d' {雖然還不是Final的版本,不過大致上看得出P55在主機板上可能的配置,以黑色+藍色為主要的配色。
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) B; l8 Q* t y$ D, UASUS P7P55 PRO MOBO, this is a big pic on it, the color mainly use the black + blue for all.7 w7 \. W' B Z
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( ^: G8 ^3 S/ O1 o以下內容 回復但請勿灌水 才能瀏覽 (Please reply to see more detail)
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CPU周圍特寫,中間為LGA 1156腳座,為FOXCONN製作,採用日系高品質固態電容,銀灰色的外殼,相當少見;- w+ u# a2 @) I, o% ?& W
MOSFET部份則用不規則散熱片加上,看起來是11相電源供電,不過這邊不多做臆測。
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9 r$ d! _( e0 D$ [# q jCPU Socket close look, LGA 1156 is in the middle by the FOXCONN, with lots of Japan-Cap and color in gray, rare seen before;$ j8 K# ]# Y' V3 w
MOSFET comes with the irregualr heatsink, looks like 11 Phases, but I can not give more details on that.
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1 M- N3 H+ T1 Z, f7 j/ ?# L電容、電感部份近拍特寫。, f7 v' s( G# ], J- N8 t
@" h6 {, r, p0 S. u' mClose look on Cap and Choke.
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LGA 1156腳位的開啟方式:首先推開拉柄,輕輕往上拉。
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Now show you the LGA 1156's design: pull out the handle.' J+ M; B/ K/ S$ t
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拉柄往後,Socket蓋子就會慢慢升起。
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3 s' _8 x" _$ h5 a9 s* A3 ZYou will see the socket is going up.4 N, J ^$ ?7 p# \0 H; o5 N
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Socket採單邊固定設計,全部打開之後就可以安裝CPU了。
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! y9 C& ~( v8 D2 v5 ZWe can install the CPU now...there is a small cap on it.& f1 x8 ^7 [# p
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! U2 s1 i+ g' WLGA 1156內部全貌,實際大小比LGA 1366小大約20%左右。
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Close look on LGA 1156, the size is about 80% of the LGA 1366.. U$ j% c. A& n( a7 j6 m& ]
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單邊固定的機制,目前Edward這邊還沒有時間測試,; E( ]7 S7 q) F) V
不過看來Intel也有針對LGA 1366蓋子過於緊繃的問題加以修正。
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. v8 T4 k2 X7 G/ p. ?0 QSingle-Side installation, I still have no time to use the ES Lynnfield on it,
7 c4 O+ m3 A4 P$ K# \but I believe Intel know the LGA 1366 problem: TOO TIGHT and HURT MY CPU !!/ p- s2 W7 O: ^/ Z
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記憶體插槽部份,採用4 DIMM DDR3 SLOT,這當然是因為LGA 1156支援雙通道DDR3而設計的。
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4 DIMM DDR3 SLOT with Dual-Channel, it is not surprised, Lynnfield is not like the Bloomfield.% H+ c' Y8 x, n" Y8 g1 q4 j& H4 N1 m
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插槽部份採單邊固定設計,應該是未來記憶體插槽的主流了;- [+ B# s" j' j* M5 y
這邊另外提供記憶體2相獨立供電。
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' d7 G! S+ h9 \, ]3 Q- x3 `. \# tThe DIMM Slot also comes with a single-side installation function/2 Phases here.2 @* H# t# f& ]. a
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' ], V1 [6 w9 ]( v9 W7 B- A# u華碩ASUS P7P55 PRO的字樣。
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The Logo of ASUS P7P55 PRO.
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慢速週邊部份,IDE採90度轉折設計,SATA Port位置較低,故採用正常設計,沒有VGA干涉的問題;
# s6 s! N( V2 s0 @3 F& YIDE後方控制晶片為JMB363,晶片組周圍以白線框出一定範圍,未來定版時散熱片可能還會有所變化。& q& s( a- v+ [9 j& K4 D
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Peripheral Part, IDE have a 90 degrees desgin for the VGA card issue,& C7 p+ c( K$ H7 F8 e2 a, a3 K0 U8 p7 b
but the sata ports are lower than 2 PCI-E Slot, so it's not a big problem to design the SATA port like a normal on;
: x7 u- U U/ N. EThe chip behide the IDE is JMB363, you can also see the white line surrounded the chipset, the layout or heatsink may change on formal release.. V n9 b( ` a g; b' ?( Z6 R' ^
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# ], q9 I2 w. v N6 E華碩ASUS P7P55 PRO提供2組PCI-E x16介面,中間卡了2組PCI-E x1介面,另有3組PCI插槽︰
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0 `! \" F# t3 [0 }6 N* \2 ~3 O; [Provide 2* PCI-E x16 and 2*PCI-E x1 between them, and there are also 3 PCI Slot here, the sound part takes the VIA solution.
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P7P55的Rear Panel部份。連同主機板上的3組USB內接腳座,P55一次可支援14組USB 2.0裝置,這邊則另有IEEE 1394與e-SATA接頭。* T/ T H1 `* r9 Y; ?5 ^
* z+ M5 H+ |# U7 ]/ XRear Panel, P55 can support 14 USB2.0 device, and you can also see the IEEE 1394 6-pin and e-SATA here.
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拆下散熱片...看一下內部的情況是怎樣。6 ?8 p5 |3 |5 ]% N( u; t: a7 A
6 B$ I, n! q# \7 DTake out the heatsink and have a close look on P55...$ E2 S# ]/ E0 G1 `' u. I
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% Z- d; D' G, u2 M e3 I+ l, ?* h仍為ES版本的Ibex Peak單晶片Intel P55 Express Chipset
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Ibex Peak single-chip: Intel P55 Express Chipset, ES version now.
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