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[XF] P55近距離+全球首度曝光:華碩「P7P55 Pro」主機板
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[XF] P55近距離+全球首度曝光:華碩「P7P55 Pro」主機板
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9 F* v. c! T8 Z$ `) i+ @5 Y' r[XF] Close Look on P55: ASUS "P7P55 PRO" hits the road$ w5 y/ D3 h6 N
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- B( L: O" s. F N「P55」這個字眼,相信硬體玩家們應該都已經聽到、也看到了不少相關的資料了。在X58、LGA 1366平台大量曝光之後,Intel已經用了好幾年的LGA 775平台,也即將走到終點。雖然說P55只是Intel 5-Series Express Chipset家族中的成員之一,後續還有P57、H55、H57、Q55即將面試,但根據可靠消息來源指出,首批LGA 1156腳位的CPU將有5款會於09年9月進入市場,而內建顯示功能的LGA 1156腳位CPU,則是可能在2010年1月左右再釋出5款,在Intel的規劃下,玩家們一定不可不知接下來的硬體上的變化。今天Edward從華碩這邊取得了即將在Computex大會中展示的主機板:華碩ASUS P7P55 PRO,雖然硬體配置與配色的部份都還不是最終版本,量產前都還可能更改,不過相信大家都對P55主機板可能的規劃,一定都有不小的興趣吧?搶先為各位報導,請接著看下去吧!
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3 ?/ ^1 P2 {* z8 WWe already heard lots of rumors about the Intel P55 Express Chipset and also can easily get data from Google. But after massive exposure on X58/LGA 1366, most of the HW Geeks pay attention on the LGA 775: is it time to change to LGA 1156? Although the P55 is the member in the Intel 5-Series Express Chipset family, we still have P57/H55/H57/Q55 chipset to meet later. According to the source, in Sept. 09, Intel will release the Lynnfield in 5 diffrent model, and then release 5 Havendale CPU in Jan. 10, so if you are a crazy HW Geek, you have to read more about this. Today Edward just got the lastest ASUS Mobo for the Computex 09: ASUS "P7P55 PRO", it is not a final version and the layout may change on formal release, but you should know the possible layout now, just reply and get the pics you want. :)1 p, }5 X: n& i+ q5 W$ p
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- q) g- l8 F. [華碩ASUS P7P55 PRO 主機板,特別拍了一張大圖給各位看看。
+ t5 l e7 q2 |( ]雖然還不是Final的版本,不過大致上看得出P55在主機板上可能的配置,以黑色+藍色為主要的配色。/ a) B( |% R' {# X
2 ]" l, D3 \! ^ASUS P7P55 PRO MOBO, this is a big pic on it, the color mainly use the black + blue for all.3 x6 f+ V2 t2 {* E1 `! {4 O
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以下內容 回復但請勿灌水 才能瀏覽 (Please reply to see more detail)
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CPU周圍特寫,中間為LGA 1156腳座,為FOXCONN製作,採用日系高品質固態電容,銀灰色的外殼,相當少見;
, l$ o: c p8 DMOSFET部份則用不規則散熱片加上,看起來是11相電源供電,不過這邊不多做臆測。8 N6 n. C$ h/ o2 L
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CPU Socket close look, LGA 1156 is in the middle by the FOXCONN, with lots of Japan-Cap and color in gray, rare seen before;1 W- Y/ O0 k! C; p" k
MOSFET comes with the irregualr heatsink, looks like 11 Phases, but I can not give more details on that.! e0 b4 D4 e+ n6 L( K$ M
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A; P- I$ {) \電容、電感部份近拍特寫。
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! J# T' z$ N1 b: X" F9 SClose look on Cap and Choke." {2 y/ {* d" h; I9 b j! M
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1 A, V3 \6 W" Q' s5 aLGA 1156腳位的開啟方式:首先推開拉柄,輕輕往上拉。
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. h& k l% d* X. r5 |Now show you the LGA 1156's design: pull out the handle.
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+ W/ k6 E5 h+ N1 w$ s% Q) I( M( g拉柄往後,Socket蓋子就會慢慢升起。
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! P" K" x1 v' C* \- jYou will see the socket is going up.
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Socket採單邊固定設計,全部打開之後就可以安裝CPU了。/ Q+ ]9 I6 L3 @4 v% i, P
* O& S+ f& l( ]; EWe can install the CPU now...there is a small cap on it.# Z& K3 Z# I% Q0 n4 X) O, e4 y
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LGA 1156內部全貌,實際大小比LGA 1366小大約20%左右。, a" ^$ m5 O0 ]" g
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Close look on LGA 1156, the size is about 80% of the LGA 1366.2 k! P% q' a' M: i
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4 {1 g$ ^( R. O: U單邊固定的機制,目前Edward這邊還沒有時間測試,
$ ?/ |' ^% |! L不過看來Intel也有針對LGA 1366蓋子過於緊繃的問題加以修正。
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Single-Side installation, I still have no time to use the ES Lynnfield on it,' t/ ?" ~' z/ l m5 Z
but I believe Intel know the LGA 1366 problem: TOO TIGHT and HURT MY CPU !!6 Q# B5 m0 ^. v% O
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記憶體插槽部份,採用4 DIMM DDR3 SLOT,這當然是因為LGA 1156支援雙通道DDR3而設計的。+ Z: T3 k$ s0 T$ L/ y* }( R/ ]. t9 P
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4 DIMM DDR3 SLOT with Dual-Channel, it is not surprised, Lynnfield is not like the Bloomfield., \) y1 A9 m% e7 b: m
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) V6 X/ E! F$ d% d! f3 R* Y4 _2 E9 U插槽部份採單邊固定設計,應該是未來記憶體插槽的主流了;
: h8 j- a$ c; f/ p" {* r這邊另外提供記憶體2相獨立供電。7 Q& I2 e9 q) q2 H
2 j, X0 B3 [1 K3 ^The DIMM Slot also comes with a single-side installation function/2 Phases here.9 C, ^8 B; f4 C
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華碩ASUS P7P55 PRO的字樣。
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The Logo of ASUS P7P55 PRO.! n! ^; `/ f4 L* u
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/ B/ y& `- s; |9 b" o慢速週邊部份,IDE採90度轉折設計,SATA Port位置較低,故採用正常設計,沒有VGA干涉的問題;" Y0 q: v3 q$ y: i# H5 E
IDE後方控制晶片為JMB363,晶片組周圍以白線框出一定範圍,未來定版時散熱片可能還會有所變化。
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Peripheral Part, IDE have a 90 degrees desgin for the VGA card issue,
' ]% Z! i9 i9 ~2 }but the sata ports are lower than 2 PCI-E Slot, so it's not a big problem to design the SATA port like a normal on;' P) p0 O2 X4 H* O) w6 } |
The chip behide the IDE is JMB363, you can also see the white line surrounded the chipset, the layout or heatsink may change on formal release.6 @; r: w# i/ v+ I, m% w
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華碩ASUS P7P55 PRO提供2組PCI-E x16介面,中間卡了2組PCI-E x1介面,另有3組PCI插槽︰
# B' m3 q# w& l音效部份則是採用了VIA的Solution。- Y/ g+ }! T8 C9 t' _7 B2 _$ i
- `' i* j4 p5 mProvide 2* PCI-E x16 and 2*PCI-E x1 between them, and there are also 3 PCI Slot here, the sound part takes the VIA solution.
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& k& Y; |7 {- f8 ^" x, PP7P55的Rear Panel部份。連同主機板上的3組USB內接腳座,P55一次可支援14組USB 2.0裝置,這邊則另有IEEE 1394與e-SATA接頭。4 |6 F! ^: C* N U% E- ?( `: S
! _- `1 U3 H1 _8 B2 X' L1 P; o) HRear Panel, P55 can support 14 USB2.0 device, and you can also see the IEEE 1394 6-pin and e-SATA here.
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拆下散熱片...看一下內部的情況是怎樣。& S: N. c, ?( |7 P5 x p. K+ p
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Take out the heatsink and have a close look on P55...
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|6 ?5 |8 v0 Y4 h5 p9 y: U6 v仍為ES版本的Ibex Peak單晶片Intel P55 Express Chipset
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" L0 R! S+ W+ {; j; x ]$ ^Ibex Peak single-chip: Intel P55 Express Chipset, ES version now.- Y: f7 o& Y3 D3 J
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