[XF] P55近距離＋全球首度曝光：華碩「P7P55 Pro」主機板

skyfx

[XF] P55近距離＋全球首度曝光：華碩「P7P55 Pro」主機板
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  S$ k2 \1 y; e, A. g9 q[XF] P55近距離＋全球首度曝光：華碩「P7P55 Pro」主機板

: [1 p6 v% ~& s/ X; n& ]1 P' y[XF] Close Look on P55: ASUS "P7P55 PRO" hits the road

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/ l8 A' R5 @) p' b「P55」這個字眼，相信硬體玩家們應該都已經聽到、也看到了不少相關的資料了。在X58、LGA 1366平台大量曝光之後，Intel已經用了好幾年的LGA 775平台，也即將走到終點。雖然說P55只是Intel  5-Series Express Chipset家族中的成員之一，後續還有P57、H55、H57、Q55即將面試，但根據可靠消息來源指出，首批LGA 1156腳位的CPU將有5款會於09年9月進入市場，而內建顯示功能的LGA 1156腳位CPU，則是可能在2010年1月左右再釋出5款，在Intel的規劃下，玩家們一定不可不知接下來的硬體上的變化。今天Edward從華碩這邊取得了即將在Computex大會中展示的主機板：華碩ASUS P7P55 PRO，雖然硬體配置與配色的部份都還不是最終版本，量產前都還可能更改，不過相信大家都對P55主機板可能的規劃，一定都有不小的興趣吧？搶先為各位報導，請接著看下去吧！
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( R, p: H& q$ ^) \1 sWe already heard lots of rumors about the Intel P55 Express Chipset and also can easily get data from Google. But after massive exposure on X58/LGA 1366, most of the HW Geeks pay attention on the LGA 775: is it time to change to LGA 1156? Although the P55 is the member in the Intel 5-Series Express Chipset family, we still have P57/H55/H57/Q55 chipset to meet later. According to the source, in Sept. 09, Intel will  release the Lynnfield in 5 diffrent model, and then release 5 Havendale CPU in Jan. 10, so if you are a crazy HW Geek, you have to read more about this. Today Edward just got the lastest ASUS Mobo for the Computex 09: ASUS "P7P55 PRO", it is not a final version and the layout may change on formal release, but you should know the possible layout now, just reply and get the pics you want. :)

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% }6 M1 w2 b5 u2 t# s華碩ASUS P7P55 PRO 主機板，特別拍了一張大圖給各位看看。
0 m5 w, w- N& v: {6 l7 K& }- [9 N: Z雖然還不是Final的版本，不過大致上看得出P55在主機板上可能的配置，以黑色+藍色為主要的配色。

ASUS P7P55 PRO MOBO, this is a big pic on it, the color mainly use the black + blue for all.
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以下內容 回復但請勿灌水 才能瀏覽 (Please reply to see more detail)
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" H" E  C/ a( d4 y* G+ M( p6 LCPU周圍特寫，中間為LGA  1156腳座，為FOXCONN製作，採用日系高品質固態電容，銀灰色的外殼，相當少見；
8 D, f! @4 G& Y" c( K. ^$ cMOSFET部份則用不規則散熱片加上，看起來是11相電源供電，不過這邊不多做臆測。

CPU Socket close look, LGA 1156 is in the middle by the FOXCONN, with lots of Japan-Cap and color in gray, rare seen before;
MOSFET comes with the irregualr heatsink, looks like 11 Phases, but I can not give more details on that.
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電容、電感部份近拍特寫。

* D. ~, i; X. z3 cClose look on Cap and Choke.
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LGA 1156腳位的開啟方式：首先推開拉柄，輕輕往上拉。
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- y! J3 Z' ^7 V0 j# ^( H' rNow show you the LGA 1156's design: pull out the handle.

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& R2 p# e# R2 d4 Y拉柄往後，Socket蓋子就會慢慢升起。
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3 r. ]; P# _, e8 C2 ]7 QYou will see the socket is going up.

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7 a6 y4 a6 q9 i% i! N, t- c9 gSocket採單邊固定設計，全部打開之後就可以安裝CPU了。

We can install the CPU now...there is a small cap on it.
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# E& C, G( P+ X( X; ELGA 1156內部全貌，實際大小比LGA 1366小大約20%左右。

Close look on LGA 1156, the size is about 80% of the LGA 1366.

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1 _! S1 y& G& E4 s/ e4 P' M單邊固定的機制，目前Edward這邊還沒有時間測試，
9 r+ Z7 a* h  |; k6 i$ m不過看來Intel也有針對LGA 1366蓋子過於緊繃的問題加以修正。
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8 W  {- {  g0 K) @6 |; g( mSingle-Side installation, I still have no time to use the ES Lynnfield on it,
but I believe Intel know the LGA 1366 problem: TOO TIGHT and HURT MY CPU !!
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記憶體插槽部份，採用4 DIMM DDR3 SLOT，這當然是因為LGA 1156支援雙通道DDR3而設計的。
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0 R, [2 y4 o5 p: U5 R4 DIMM DDR3 SLOT with Dual-Channel, it is not surprised, Lynnfield is not like the Bloomfield.
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插槽部份採單邊固定設計，應該是未來記憶體插槽的主流了；
這邊另外提供記憶體2相獨立供電。
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The DIMM Slot also comes with a single-side installation function/2 Phases here.
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華碩ASUS P7P55 PRO的字樣。
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. Z* ^  j4 X- ?8 o4 l. [The Logo of ASUS P7P55 PRO.
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6 O" ?' e0 I5 ]9 `! E慢速週邊部份，IDE採90度轉折設計，SATA Port位置較低，故採用正常設計，沒有VGA干涉的問題；
% _% L. g! S8 r2 M5 B, eIDE後方控制晶片為JMB363，晶片組周圍以白線框出一定範圍，未來定版時散熱片可能還會有所變化。
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Peripheral Part, IDE have a 90 degrees desgin for the VGA card issue,
8 ?4 u7 b' f8 e" i, D" Abut the sata ports are lower than 2 PCI-E Slot, so it's not a big problem to design the SATA port like a normal on;
. d$ {4 K6 [: [0 r' G. t1 R- s0 dThe chip behide the IDE is JMB363, you can also see the white line surrounded the chipset, the layout or heatsink may change on formal release.



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5 o6 H4 N9 Z8 I& b華碩ASUS P7P55 PRO提供2組PCI-E x16介面，中間卡了2組PCI-E x1介面，另有3組PCI插槽︰
: g9 _" E. C+ y6 b音效部份則是採用了VIA的Solution。
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Provide 2* PCI-E x16 and 2*PCI-E x1 between them, and there are also 3 PCI Slot here, the sound part takes the VIA solution.



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1 r$ o  `( U5 z/ g: z$ h: e0 I. _P7P55的Rear Panel部份。連同主機板上的3組USB內接腳座，P55一次可支援14組USB 2.0裝置，這邊則另有IEEE 1394與e-SATA接頭。

  O& C2 X7 `  f! o" T; U; }- s* gRear Panel, P55 can support 14 USB2.0 device, and you can also see the IEEE 1394 6-pin and e-SATA here.




拆下散熱片...看一下內部的情況是怎樣。

Take out the heatsink and have a close look on P55...
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仍為ES版本的Ibex Peak單晶片Intel P55 Express Chipset
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$ V5 s: a) C' F0 aIbex Peak single-chip: Intel P55 Express Chipset, ES version now.



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skyfx

小結：準備好銀子，P55來了！
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Final thinking:

8 _" Z/ L, C. r6 g" \Watch your wallet, P55 is coming !!
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以目前手上這張華碩ASUS P7P55 PRO主機板的配置而言，產品應該已經相當接近量產的階段了。以已知的Intel Roadmap來看，近期會以尚未具備內顯功能的Lynnfield處理器打先鋒，而具備內顯功能的Havendale處理器，則可能會依據實際銷售狀況伺機而動，不過P55則是兩者均能支援，且屆時Intel 5-Series Express Chipset家族也一定會依據市場需求逐一釋出。不過就Edward的看法來說，在實際效能未知之前，手上有P45/P35/X48/X38的玩家們，不妨耐心等待一下，因為目前已經有小道消息傳出，LGA1156的效能相較於LGA775平台而言，並沒有太多驚喜，剩下的...就等Edward親自測試一下才知道囉！
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4 k6 w. x% k7 [3 S  Z文章寫到這邊，希望大家喜歡。

skyfx

不好意思，好像有人发过了，请版主删除吧

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