[不可不看] Intel 32nm家族全系列介绍

itany

先上路线图：






file:///C:/DOCUME%7E1/Itany/LOCALS%7E1/Temp/moz-screenshot-2.jpgfile:///C:/DOCUME%7E1/Itany/LOCALS%7E1/Temp/moz-screenshot-3.jpg

itany

Intel Accelerating 32nm Development and Product Introductions

In January, DailyTech reported on Intel's Q4 results. During a conference call that we were a part of, Intel's President Paul Otellini repeatedly stated his commitment to the 32nm development process.

Today, DailyTech has learned that Intel's P1268 32nmdevelopment process is proceeding much faster than expected. Intel istherefore announcing an accelerated product ramp, and will beintroducing Westmere-based mobile and desktop processors inthe fourth quarter of 2009, with volume possible in time for theChristmas shopping season.

Intel is spending $7 billion over the next two years on equipment for32nm. For all of 2009, Intel plans to spend $5.4 billion on Researchand Development across all product lines.

Fab D1D, Intel's 300mm development fab in Hillsboro, Oregon, will bethe prototype line, just like for the 45nm process. Over the next sixmonths, this unique factory will turn the 32nm process from theresearch phase into the production phase. It will be in Hillsboro thatIntel will adjust the production line to meet its yield and costrequirements. Once the process has been refined enough, Intel can usethe lessons learned to convert other fabs to the 32nm process.

D1D is already outfitted with 32nm equipment, and yields so far aregood. D1C and AFO (Aloha Factory Operations), also in Oregon, will rampup in the fourth quarter of this year.

Intel's "Megafab", Fab 32 in Chandler, Arizona, will start 32nmproduction in early 2010, followed by Fab 11X in Rio Rancho, New Mexico.
Fab32 was Intel's first high volume 45nm microprocessor Fab. Theyspent $3 billion on a brand new building and the latest equipment toproduce 45nm chips with hafnium-based high-k metal gate transistors,all on a 300mm wafer line. It first opened in 2007, with 184,000 squarefeet of clean room space. The completed Fab 32 structure measures 1million square feet.

DailyTech will be presenting details of Intel's 32nm product roadmap later today.

Intel将在未来的两年投资70亿刀建设晶圆厂，并将投资54亿刀用于产品的研发。

Intel俄勒冈州D1D工厂已经准备好投产，临近的D1C也会在第四季度投产，而亚利桑那州Fab 32和新墨西哥州Fab 11X将在2010年早期陆续投产。

Intel将在32nm采用浸润式光刻和第二代High-K、Metal-Gate技术。

itany

Intel Aims for Efficiency With New Server Roadmap

"Nehalem" and "Westmere" variants

Intel'sCore i7 was introduced in November last year to resounding cheers fromthe enthusiast community. Sales haven't been what Intel was hoping for,however, due to high platform costs and a slumping global economy.

The real money for Intel is in the server space, as Fortune 1000companies and server farms will pay for performance. These customerswill pay even more for power efficiency in order to reduce theircooling and power costs.

Intel is planning a series of Nehalem based server chips in order to further tap into this market. It will introduce a Xeon 5000 series of server chips, codenamed Nehalem-EP (Efficient Performance), supported by the Tylersburg-EP platform using Tylersbergchipsets. Targeted at the 2S (Dual Socket) market, it features fourcores and second generation Hyper-Threading, enabling processing ofeight threads. The first of these will be available at the end ofMarch, to be supplanted in Q2 of 2010 by a Westmere variant.

In Q3, entry level Xeon 3000 series processors will be launched based on the Lynnfieldlineup. It will use the Foxboro platform based on 5 serieschipsets. These chips will be in production for several years, evenalongside dual-core quad-thread Xeons based on 32nm Clarkdale CPUs that will be introduced in Q1 2010. The 3000 series will have on-die integrated graphics to save power.

The most profitable segment for Intel is in the 4S and 8S space.7000 series Xeons with eight cores and capable of sixteen threads aretargeted for the end of this year. Using the Nehalem-EX variant, it is built on the Boxboro-EX platform using Boxboro-EX chipsets. This is expected to be replaced at the end of 2010 by a 32nm Gulftown variant.

比起桌面平台，服务器才真正是吸钱的大头。不仅高性能计算能够赚钱，如果具有很好的节能特征，那么还将赚更多的钱。

今年3月底，Intel将推出代号Nehalem-EP的双路Xeon 5500，规格和芯片组支持与桌面的Core i7基本相当。2010年Q2将会有相应的Westmere家族产品接班。

在今年Q3，将会有入门级的Xeon 3k。与之前的认识不同，这个系列将采用Lynnfield核心，和桌面的i5规格接近，也就是双通道DDR3、集成PCIe控制器，采用DMI和南桥连接，当然芯片组也会共享P系列芯片组。2010年Q1，这个Xeon系列甚至会利用Clarkdale，集成GPU核心，用以节约能耗。

最赚钱的4路和8路市场，将会是8核心Nehalem-EX的Xeon 7k家族的地盘。今年的年底将会上市，含有8个核心和16个线程能力。其搭配的芯片组是Boxboro-EX。

itany

Intel Targets Back-to-School Season With Core i5, New Chipsets

Q3 2009 Launch

                        Intel's has 32nm plans with Clarkdale and Arrandale for the mainstream value segment, but enthusiasts who are looking for quad core performance at a reasonable price will look at Lynnfield and Clarksfield instead.

Lynnfield is the 45nm quad core variant of the Core i7, featuring 8MB of L3 cache and an on-die dual-channel DDR3 controller. Based on Nehalem,it is targeted at the mainstream performance segment, and uses a newLGA-1156 socket that is incompatible with the Core i7's LGA-1366 socket.

With new sockets will come new chipsets. Intel will expand their 5series of chipsets with new models for consumers and businesses. All Nahalem and Westmere based products use DDR3.

The Q57 chipset, codenamed Piketon, is targeted at businesses, while the P55 chipset, codenamed Kings Creek, is targeted at consumers.

Kings Creek will be supplemented in Q1 2010 by the P57. Bothwill have support for two external 8-lane PCIe graphics. They aresupposed to be in the Performance mainstream segment.

Neither USB 3.0, SATA 6Gb/s, PCIe 3.0, or ECC memory support were on the list of features that DailyTech received, although this may change in the future.

Clarksfield is the mobile version of Lynnfield for laptops. It uses the Capella Platform with a new chipset codenamed Ibex-Peak M. As with the current Centrino 2 platform, wireless internet will be available through an 802.11n Wi-Fi module (Puma Peak) or a WiMAX chipset (Kilmer Peak).

DailyTech has received information that Lynnfield and Clarksfield will be replaced by quad core Westmere variants in the middle of 2010. Intel refuses to comment on unannounced products, although they did state that "additional 32nm productswill follow in 2010".

The timing couldn't be better, as Windows 7 is slated to launch at around the same time. It will have many features, including improved usage of multiple cores.

Intel的主流四核心处理器将会是Core i5，2009年Q3上市。

首期Core i5将基于Lynnfield核心。和之前的规格一致，双通道的DDR3内存，并集成PCIe控制器。

搭配的芯片组，P55将针对主流消费者，Q57针对商业用户。P57将在明年Q1上市。目前，对于PCIe 3.0、USB 3.0、SATA 3的支持还没有明确的时间表。

Clarksfield是Lynnfield的移动版本。其搭配Ibex-Peak M芯片组。新的迅驰平台的网络部分将与现有的迅驰2采用相同的无线网络技术。

其32nm的后继者可能在2010年中期上市，不过现在还不能够确定。

Core i5的上市时间恰逢Windows 7档期，强强联手，将引发更多消费热情

Prescott

按此图，到了32nm，高端桌面和主流桌面的性能差距迅速拉大，6C/12T Vs 2C/4T:funk:
AMD``FANS 发表于 2009-2-11 13:35

实在不行可以上胶水

itany

Intel Replaces "Havendale" and "Auburndale" With 32nm Die Shrinks

Product cancellations are usually bad, but not if they are replaced with something better.

                        Intel's P1268 32nm development process is progressing better than expected. It is doing so well, in fact, that they are cancelling Havendale and Auburndale, the 45nm mainstream value versions of Nehalem. These were supposed to be the first mass produced chips with on die integrated graphics and an integrated memory controller.

Havendale was a dual core version of Lynnfield, itself the Core i5 mainstream version of the Nehalem Core i7. It would've used the same LGA-1156 socket as Lynnfield.

Auburndale was the mobile version of Havendale, but it had more in common with Clarkfield, the mobile variant of Lynnfield.

Having graphics on die saves motherboard manufacturers money becausethere is no longer a northbridge to buy and integrate. By loweringplatform costs, Intel wants to bring Nehalemtechnology to a new market, at a price point it previously was not ableto. This would also drive DDR3 adoption, something that DRAM manufacturers have been anticipating.

The original launch date for Havendale was towards the end of Q4, missing most of the crucial Christmas buying season. Auburndale would've been introduced in Q1 of 2010. This was to allow time for the production ramping of Lynnfield and Clarksfield into the mainstream market.

With 32nm development so advanced, Intel made the decision to pull in Clarkdale and Arrandalefrom the middle of 2010 to Q4 of 2009. They seem confident that theywill be able to ramp in time to meet demand from the critical Christmasseason.

Clarkdale is the 32nm successor to Havendale, builtusing two logic cores and a graphics core using what Intel's"Multi-Chip Packaging". The logical cores are built on a 32nm process,but the integrated memory controller and graphics core are built on a45nm process. It is capable of running four threads at once with a newgeneration of Hyper-Threading, promising increased efficiency. A server variant of Clarkdale is also to be introduced later in Q1 of 2010.

Arrandale is the mobile version of Clarkdale, also with integrated on die graphics. It will also allow switchable graphics within Windows 7 and Windows Vista, enabling the use of a higher performance GPU when plugged in.  Both Clarkdale and Arrandale will use 5 series chipsets, exclusively with DDR3.

通常，产品撤销是坏事；不过，如果有更好的产品及时顶替，那就完全相反了。Intel撤销了Havendale和Auburndale，并用32nm产品替代，就是后者。

本来，Havendale将会是Core i5家族双核心和集成GPU的型号。不过，由于32nm制程的进展非常顺畅，以至于其将会直接被32nm型号替代，代号为Clarkdale。插座和Lynnfield版本一样，都是1156.

通过将GPU和北桥放在CPU内部，可以大大降低主板成本。这也将促进DDR3的全面普及。

本来，Havendale由于在年底推出，会错过圣诞的购物潮流，但是，现在Intel对32nm很有信心，将会把Clarkdale放在今年的Q4推出，抢占圣诞档期。

Clarkdale的CPU核心将采用32nm工艺，而内存控制器和GPU核心会放在CPU内部的北桥上，采用多管芯封装技术胶水在一起。这一点和Lynnfield是不同的。其余的特性和Nehalem的其他产品线相同，两个核心将支持4个线程。Clarkdale还将进军低端服务器，在2010年的Q1.

Arrandale是Clarkdale的移动版本，支持外接显卡，并可以在内外GPU之间进行动态切换，以更好节能。

Asuka

{titter:] 坐等肥龙系列降价50%

Nowotny

坐等Intel给某些人发bonus

fit206

记个号~顶顶更健康！

itany

"Gulftown" is the Flagship of 32nm "Westmere" Line

Power consumption not disclosed

                        Intel's aggressive drive to 32nm has many reconsidering their purchasing plans over the next year.

All Westmere chips will feature higher performance andlower power consumption. This is made possible through the use offourth generation strained silicon and second generation high-k/metalgate technology, referring to the use of a High-k gate dielectric and ametal gate electrode.

Intel is reporting at least a 22 percent performance increase clockfor clock over their 45nm process, and there are still many steppingsto go before they go to market. Westmere also has seven new instructions, designed for accelerating encryption and decryption algorithms. All Nahalem and Westmere based processors will use DDR3 exclusively.

The first Westmere chips will be codenamed Clarkdale, featuring two 32nm logical processors paired with a graphics coreand an integrated memory controller built on a 45nm line. By using"Multi-Chip Packaging", Intel will be able to minimize their lossesfrom defective chips on a maturing manufacturing line. Arrandale is the mobile variant, with additional power saving technology for laptops.

Gulftown is the successor to the Nehalem-based Core i7 and is due in the middle of 2010. Gulftownhas six cores, but is capable of efficiently handling twelve threads atonce, thanks to its next generation Hyper-Threading. It will use theX58 chipset due to the LGA-1366 socket, but there are rumors of a newerversion coming in 2010 that will feature support for USB 3.0 and SATA6Gb/s.

DailyTech has received information that Core i5 Lynnfield and Clarksfield CPUs will be replaced by quad core Westmere variants in the middle of 2010. Intel refuses to comment on unannounced products, although they did state that "additional 32nm productswill follow in 2010".

Right now, Intel is focusing on ramping up production of Clarkdale and Arrandalefor the fourth quarter of this year. Fab D1D, Intel's manufacturingresearch factory in Hilsboro, Oregon, is already outfitted with 32nmequipment and will begin commercial production in Q4. Fab D1C and AFO(Aloha Factory Operations), in Oregon as well, will also ramp up in thefourth quarter of this year.

Intel's "Megafab", Fab 32 in Chandler, Arizona, will start 32nmproduction in early 2010, followed by Fab 11X in Rio Rancho, NewMexico. Other fabs may follow to meet demand.

Intel现在正在积极推进32nm工艺。通过第四代变应硅和第二代High-K/Metal-Gate技术，将实现更高的性能及功耗效能。

Intel宣称，32nm产品在相同频率的情况下，将至少提供22%的性能增长。不过，目前的产品到上市还要一些更多的工作要做。Westmere将增加新的7条指令，将有助于加快加密和解密运算。

Intel的32nm将从集成GPU的Clarkdale开始，其CPU的管芯小，有助于保证最初期的良率。

Gulftown是Bloomfield的接班人，6个核心，12个线程，配合x58芯片组。小道消息称，2010年会有新的芯片组支持USB 3.0和SATA 3。

在2010年中期，可能会有4核心8线程的Westmere衍生产品。Intel对此拒绝评论，不过确定的是，2010年将会有后续产品推出。

wukefei1219

看的真累.INETL这次出的也太多太乱了.

itany

按此图，到了32nm，高端桌面和主流桌面的性能差距迅速拉大，6C/12T Vs 2C/4T:funk:
AMD``FANS 发表于 2009-2-11 13:35

1156会有4C 8T的

itany

目前看只有45nm Lynnfield, 32nm的没有在roadmap上
AMD``FANS 发表于 2009-2-11 14:23

呵呵，就和过渡到45nm一样
先是双核心打头，之后6核心Xeon跟着，最后才是主流的桌面4核心
用上一代4核心主打，Q6600一样

yooyea

Intel的生产能力还是要好一些，AMD如果没有突破性的技术改进，恐怕只能走廉价路线了

zaknafein

的确没有, 产能大概跟不上吧...

pjtomtai

呵呵，就和过渡到45nm一样
先是双核心打头，之后6核心Xeon跟着，最后才是主流的桌面4核心
用上一代4核心主打，Q6600一样
itany 发表于 2009-2-11 14:44 http://we.pcinlife.com/images/common/back.gif[/quot ...
AMD``FANS 发表于 2009-2-11 15:13

不到F32和F11X也转入32NM制程,主流(4C/8T)产品不会上市的,2009只有D1D和D1C转入32NM,F32和F11X要等到2010.

the_god_of_pig

越是经济危机越要有所作为，否则死路一条{lol:]

thinkpad.drl

一切皆是过渡{lol:]

Megatron

准备下月尝鲜i7 Xeon