Intel展示Larrabee晶圆

itany

Santa Clara, California-based Intel is expected to make its debut into the world of discrete graphics, by introducing its highly anticipated Larrabee-based many-core processing unit. The world's leading chip maker has recently showcased at the IDF (Intel Developer Forum) Spring 2009 a 300mm wafer containing Larrabee chips. This can only prove that we are getting even closer to Intel's first discrete graphics solution,by which time we shall have stronger competition in the market of computer graphics. At IDF, Pat Gelsinger, Intel's senior vice president and general manager of the Digital Enterprise Group, took to the stage to talk about the company's recently launched Xeon 5500 processors, the Nehalem architecture in both of its server and desktop product families, 32nm Westmere chips and the highly anticipated Larrabee chip. Unfortunately, Mr. Gelsinger didn't reveal any specific details on its upcoming chips, regarding the core frequencies, memory and overall design.

However, he did state that the company expected the first Larrabee-powered graphics card to become available later this year or by the start of 2010. Either way, the chip maker is currently in the process of testing the Larrabee, which is also confirmed by the showcased 300mm wafer that contained the Larrabee chips. According to a recent news-article on French-language Hardware, the chips were significantly large, similar to those of NVIDIA's 65nm-based GT200 models. Their size and many-core architecture would most likely require a lot of transistors.

One of the main mysteries surrounding Intel's upcoming Larrabee chips is related to the process technology that is going to be used in their manufacturing process. There are some reports that suggest Intel is going for the 45nm approach, but given the company's plan to ramp up the adoption of 32nm production lines, there's a good chance we'll be seeing 32nm Larrabee chips sooner rather than later.

itany

Intel Larrabee独立显卡晶圆首次公开展示

驱动之家[原创] 作者：上方文Q 编辑：上方文Q　2009-04-10 16:14:15 11428 人阅读 [投递]

在北京的2009年春季IDF上，Intel再次谈到了代号Larrabee的独立显卡产品，而且由高级副总裁兼数字企业事业部总经理帕特·基辛格(Pat Gelsinger)第一次公开展示了相关晶圆。 虽然看不清晶圆细节，但依稀可以辨别Larrabee核心相当巨大，颇有些65nm GT200的架势，估计能达到600平方毫米左右(65nm GT200是576平方毫米)。 不过很遗憾，基辛格只是给了大家惊鸿一瞥的机会，并说Larrabee将于2009年底或2010年初发布，没有提及实际生产工艺和规格参数。至于有关Larrabee的技术细节，诸如编程模式之类的，相信我除非专业研究你不会感兴趣的。

julian110

看上去块头是有点大