Broadcom最新 BCM92070 内置蓝牙模块 V3.0

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Broadcom最新 BCM92070 内置蓝牙模块 V3.0
HP备件号：496754-001
BCM2070 - Single-Chip Bluetooth? 3.0 HCI SolutionSingle-Chip Bluetooth? 3.0 HCI Solution
The Broadcom BCM2070 is a monolithic, single-chip, stand-alone baseband processor with a high performance integrated 2.4-GHz RF transceiver. It is fully compliant with Bluetooth 3.0 and all prior standard features. Processed using advanced 65-nm LP CMOS technology, the BCM2070 offers an unmatched integrated solution with the smallest footprint and lowest cost of implementing a Bluetooth system.

The use of the advanced 65-nm process enables the BCM2070 to achieve Broadcom's smallest package size and lowest possible current consumption in all modes of operation. The BCM2070 has an architecture that has been designed to take advantage of the High Speed standard. Its superior integrated RF design enables much higher output power and lower input sensitivity, which makes the BCM2070 the ideal solution to support all Bluetooth modes. The built-in Class 1 PA, which is capable of transmitting +10 dBm output power, can be enabled with 2.5V power supply. Together with Broadcom's leading Packet Loss Concealment (PLC) technology, which reduces packet loss and bit error rates, the BCM2070 can effectively combat interference and reduce dropped connections that result from distance and physical obstructions. These translate directly into higher and more reliable throughput, greater link-range and superior audio performance.
博通(Broadcom)新推出一款单芯片[url=]蓝牙[/url](Bluetooth)2.1+EDR方案[url=]BCM2070[/url]，该组件采65nm CMOS制程与Broadcom SmartAudio音效与语音强化技术，过去，SmartAudio仅被运用在无线耳机上，现在则被用来改善手机的使用寿命和音频品质。

BCM2070单芯片整合了高效能的2.4GHz 'Class 1'蓝牙射频功能，支持2.1+EDR，只需使用小于25mm2的电路板设计空间；此外，它也比其它蓝牙方案节省高于四成的功耗需求。

Broadcom同时为BCM2070导入新的RF射频架构技术。此架构有助于改善接收灵敏度和传送的输出功率，进而确保行动电话与耳机产品之间有更佳的连结性。由于支持先进的[url=]A2DP[/url]蓝牙规格，新款芯片能让多个使用者同时收听串流的立体声音乐。

BCM2070中的音频强化技术包括Broadcom独特的遗失封包补偿(packet loss concealment，PLC)技术，它能重塑音频串流，为遗失资料封包做补偿，进而提供更清晰的数字语音通讯效果。
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