德仪今年将推OMAP 5移动芯片 阻挡高通等竞争

PRAM

北京时间2月8日消息，据国外媒体报道，德州仪器周一表示将于今年下半年推出具有更高性能的移动芯片OMAP 5，以阻挡来自高通和Nvidia在移动芯片市场中的竞争。

位于美国德克萨斯州达拉斯的德州仪器周一在一份声明中表示，这款移动芯片可供手机和平板电脑使用，具有运行个人电脑程序功能，支持3D图形处理。OMAP 5将于今年晚些时候发布，配置该款芯片的手机和其它设备将于明年进入市场销售。

德州仪器的OMAP芯片阵容一度曾垄断所谓的应用程序处理器市场，这样的芯片在手机中运行操作系统以及其它高级功能。现在，高通、Nvidia、Marvell Technology和英特尔-T正在加入到这种芯片的订单竞争队列，并且形成对苹果iPhone和iPad强有力的竞争。

德州仪器OMAP平台部门总经理雷米·艾尔-奥扎尼(Remi El-Ouazzane)表示，OMAP 5基于ARM Cortex A-15架构打造，这也是该公司在该市场率先所为，从而在行业中占据先机。OMAP 5拥有双核A-15，2GHz频率，比其前一代OMAP 4快三倍，耗能却低60%。

周一在美国纽约证券交易所，德州仪器股价下跌18美分，报收于35.26美元。该公司股价今年以来累计上涨了8.5%

PRAM

	OMAP5430	OMAP5432
Target Markets	Area-sensitive (Smartphones, Tablets)	Cost-sensitive (mobile computing, consumer)
Process node	28 nanometer low-power process
ARM® Cortex™-A15 Clock Speed (two)	Up to 2 GHz
2D & 3D Graphics	Multi-core, hardware accelerated
Video performance (2D)	1080p60 multi-standard
Video Performance (3D)	1080p30 multi-standard
Imaging Performance	Up to 24 MP (MIPI® CSI-3+ 3x MIPI® CSI-2+ CPI interfaces)	Up to 20MP (3x CSI-2+ CPI interfaces)
Memory Support	2xLPDDR2	2xDDR3/DDR3L
Peripheral Support	UART (6x), HSIC (3x), SPI (4x), MIPI® UniPortSM-M, MIPI® LLI, HSI (2x)	UART (5x), HSIC (2x), SPI (3x) MIPI® UniPortSM-M, MIPI® LLI, HSI
Package	14mm x 14mm PoP 980 balls 0.4mm pitch (240-ball, 0.5mm PoP) I/F)	17mm x 17mm BGA 754 balls 0.5mm pitch (w/depop)

PRAM

TI Home > Wireless Handset Solutions > OMAP™ Applications Processors > OMAP™ 5 Platform > OMAP5430 OMAP™ 5 Platform: OMAP5430 Chip Block Diagram Enlarge  OMAP5430 Key Benefits Designed to drive Smartphones, Tablets and other multimedia-rich mobile devices Multi-core ARM® Cortex™ processors Two ARM Cortex-A15 MPCore processors capable of speeds up to 2 GHz each Two ARM Cortex-M4 processors for low-power offload and real-time responsiveness Multi-core POWERVR™ SGX544-MPx graphics accelerators drive 3D gaming and 3D user interfaces Dedicated TI 2D BitBlt graphics accelerator IVA-HD hardware accelerators enable full HD 1080p60, multi-standard video encode/decode as well as 1080p30 stereoscopic 3D (S3D) Faster, higher-quality image and video capture with up to 24 megapixels (or 12 megapixels S3D) imaging and 1080p60 (or 1080p30S3D) video Supports four cameras and four displays simultaneously Packaging and memory: 14mm x 14mm, 0.4mm pitch PoP dual-channel LPDDR2 memory [table=98%] Feature Allows 28 nanometer CMOS low-power process The highest levels of processor performance and lowest power consumption Multi-core ARM architecture with Symmetric Multiprocessing (SMP) including 2 ARM Cortex-A15 MPCore processors and 2 ARM Cortex-M4 processors Higher mobile computing performance 2-3x higher performance versus previous generation Faster user interfaces and less power consumption SMP's scalable performance activates only the cores that are needed for that particular process Hardware virtualization through Hypervisor allows power and performance-efficient, multiple guest operating system (OS) support IVA 3 HD multimedia accelerator Full HD 1080p60 multi-standard video encode/decode Hardwired codecs deliver high performance at low power levels Programmable DSP provides flexibility for future codecs Provides support for high definition stereoscopic 3D encode/decode at 1080p30 Multi-Imagination Technologies' POWERVR™ SGX544-MPx graphics core Greater than 5x performance increase versus previous generation Compelling 3D graphics interfaces Supports large screen sizes at higher frames per second while still consuming less power than previous cores Supports all the major APIs, including: OpenGL® ES v2.0, OpenGL® ES v1.1, OpenCL v1.1, OpenVG v1.1 and EGL v1.3 Multi-core imaging and vision processing unit Enhanced image quality, up to 24-megapixel 2D or 12-megapixel S3D Faster system performance Reduced external components Lower system cost Lower system power M-Shield™ mobile security technology enhanced with ARM TrustZone® support and based on open APIs Content protection Transaction security Secure network access Secure flashing and booting Terminal identity protection Network lock protection SmartReflex™ 3 technology Advanced power reduction Dynamically controlled voltage, frequency and power based on device activity, modes of operation and temperature Ultra low voltage retention support TI power management/audio codec companion devices support Maximized battery life Boosted system performance Significantly reduced board space and system cost Efficiently managed energy and audio functionality Low Power Audio Provides up to 140+ hours of CD-quality audio playback Comprehensive Software Suite Faster time to market Lower R&D costs Ensures highest performance possible in customer’s handsets

[/td][/tr]
[/table]

hyj201

看指标还是不错的  竞争越激烈越好～

yebx

耗能却低60%