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http://newscenter.ti.com/Blogs/newsroom/archive/2011/02/07/not-just-a-faster-horse-ti-s-omap-5-platform-transforms-the-concept-of-mobile-615064.aspx
看了下,GPU继续用POWERVR,跟PSP2一样是多核MP,Cortex-A15比同频的A9快50%,OMAP5平台计算性能是OMAP4的3倍,GPU是OMAP4的5倍,但比上OMAP 4平台还要少60%功耗,基本上是多核化设计的,包括CPU,GPU,DSP...
TI预计下半年出sample,而终端产品要明年下半年...
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Highest performance, lowest power...yet again
The 28 nanometer OMAP 5 applications processors carry on the OMAP family tradition of delivering significant increases in performance and functionality, while lowering power consumption compared to their predecessors. Specifically, they offer up to 3x processing performance and five-fold 3D graphics improvement, yet provide a nearly 60 percent average power reduction compared to a sample user experience on the OMAP 4 platform. Additionally, the OMAP 5 platform's software is designed for maximum reuse to ease migration from the OMAP 4 platform.
"The next decade will bring a revolution in mobile computing, as devices continue to converge, attempting to become one single device that meets all of our computing, entertainment, and complex day-to-day needs and interests. However, the bridge to true mobile computing enablement was missing until today. The OMAP 5 platform will be at the heart of driving the mobile computing revolution by delivering the highest computing, graphics and multimedia performance possible within the low power budget required by mobile form factors," said Remi El-Ouazzane, vice president, OMAP platform business unit, TI.
Industry's best all-around applications processor platform
The OMAP 5 platform sports an impressive list of features and benefits supporting everything from open source platforms to complementary TI technologies, including:
| | | | | Two ARM Cortex-A15 cores, up to 2 GHz each | 3x higher performance to deliver the promise of mobile computing | | | Low-power offload and real-time responsiveness | | Multi-core 3D graphics and dedicated 2D graphics | 5x higher graphics performance; accelerated and more responsive user interfaces | | Multi-core imaging and vision processing unit | Next-generation computational photography experiences – face recognition, object recognition and text recognition | | Multi-core IVA HD video engine | 1080p60 HD video and high performance, low bit rate video teleconferencing | | Advanced, multi-pipeline display sub-system | Supports multiple video/graphics sources for composition | | Can support four simultaneous displays | Supports three high-resolution LCD displays (up to QSXGA) and HDMI 1.4a 3D display | | High performance, multi-channel DRAM and efficient 2D memory support | Supports advanced use cases with multiple ARM cores and multimedia operation; provides better user experiences without lag or quality degradation | | TI M-Shield™ mobile security technology with enhanced cryptography support | End-to-end device and content protection | | New, high-speed interfaces | Supports USB 3.0 OTG, SATA 2.0, SDXC flash memory and MIPI® CSI-3, UniPort-M and LLI interfaces to support higher Wi-Fi and 4G network and HD content data rates | | Optimized audio, power and battery management platform solutions | Complementary TI devices for an optimized OMAP 5 platform solution | | Next-generation connectivity technologies | HD wireless video streaming, wireless display, mobile payments and enhanced location-based services | | *Comparative statements compare OMAP 5 platform to OMAP4430 applications processor. | | | |
Strengthening the OMAP 5 platform's value, TI leverages its open source community involvement to benefit customer product development. Early extensive work in community projects translates to a significant quality and schedule advantage for device manufacturers, including power, memory and performance optimization. Additionally, TI's pre-integrated software packages for popular Linux-based distributions help manufacturers achieve maximum system-level performance while driving a faster time-to-market.
Availability
TI's OMAP 5 platform is expected to sample in the second half of 2011, with devices on the market in the second half of 2012. The OMAP5430 processor is offered in a 14x14mm Package-on-Package (PoP) with LPDDR2 memory support. The OMAP5432 processor is offered in a 17x17mm BGA package with DDR3/DDR3L memory support.
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