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1. Memory (K)
2. DRAM : 4
3. Small Classification
H : DDR SDRAM
4~5. Density, Refresh
28 : 128Mb, 4K/64ms
51 : 512M, 8K/64ms
56 : 256M, 8K/64ms
1G : 1G, 8K/64ms
6~7. Organization
04 : x4
08 : x8
16 : x16
32 : x32
06 : x4 Stack ( Flexframe )
07 : x8 Stack ( Flexframe )
8. Bank
3 : 4Bank
9. Interface, VDD, VDDQ
8 : SSTL-2, 2.5V, 2.5V
10. Generation
M : 1st Generation
A : 2nd Generation
B : 3rd Generation
C : 4th Generation
D : 5th Generation
E : 6th Generation
F : 7th Generation
11. "─"
12. Package
T : TSOP2
U : TSOP2 ( Lead Free )
N : sTSOP2
V : sTSOP2 ( Lead Free )
G : FBGA
Z : FBGA ( Lead Free )
13. Temp, Power
C : Commercial, Normal ( 0℃ ~ 70 ℃ )
L : Commercial, Low ( 0 ℃ ~ 70 ℃ )
I : Industrial, Normal ( -40 ℃ ~ 85 ℃)
14~15. Speed (Wafer/Chip Biz/BGD: 00)
CC : DDR400 ( 200MHz @ CL=3, tRCD=3, tRP=3 )
B3 : DDR333 ( 166MHz @ CL=2.5, tRCD=3, tRP=3 )
AA : DDR266 ( 133MHz @ CL=2, tRCD=2, tRP=2 )
A2 : DDR266 ( 133MHz @CL=2, tRCD=3, tRP=3 )
B0 : DDR266 ( 133MHz @ CL=2.5, tRCD=3, tRP=3 ) |
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