|
Advanced Computerized Protection Circuitry - improved protection circuitry, for fewer failures. When the protection circuit is activated, the amp will turn off. 1 c, @$ G- D- E2 |
Larger Terminal Blocks - all models can accept up to 4 gauge wire (i.e. more current capability)
$ a) l: ?3 A5 U# DLarger Heatsink - each model "grew up" by 1 to 2 inches with substantially more mass. Greater cooling capabilities, and longer initial time to thermal.
+ s9 S/ U. G8 tLarger Output MOSFETS And Larger Power Supply MOSFETS - provide better power stability and improved reliability. 6 Q& Z, ~" N4 f0 o
New Thermal Pads Under MOSFETS - because silicon grease, formerly used under the MOSFETS, broke down over time and spilled out onto circuit board, we replaced it with polymer thermal pads that offer better transfer of heat from MOSFET to the heatsink. Over time, the polymer actually fills in the pores, creating an even tighter seal. This improvement offers a greater degree of consistency in manufacture for better product reliability.
2 v' l# C* a( j' m4 x3 kImproved ISO-FEET - upgraded to a more pliable nylon material, for improved durability and flexibility.
" V2 b! y# w1 M+ }; a8-Volt RMS Input - this Large Signal capability allows better integration with high voltage output source units, increased dynamic range and better Signal-to-Noise ratio in the system.
G; ?0 S* o2 I5 t) O8 VContinuously Variable Crossover - this allows the user to adjust the crossover frequency from 40Hz to 175Hz with a high or low pass configuration, including adjustable crossover slope from 12db - 18db/Octave. " t+ h+ `3 Y: y; q' {" ?
Advanced PCB Design Technology - a new FLOOD technique in circuit board design allows us to truly "flood" the circuit board with copper for substantially higher current capability, lower distortion and increased reliability. ( m( e! m# Z0 X4 P2 L% Y
Thermal Reliefs - New "star pattern thermal reliefs" improve solder connections and increase reliability. 4 @3 i" W V$ V. \0 y
Individual Gain Controls For Left/Right Channels - for better tracking and to make it easier to center up the soundstage (a critical element in the competition circuit). 3 i1 [ O; M2 y7 D; `
Reverse Outputs - when the user selects the highpass setting on the crossover, a complimentary lowpass signal is passed through the RCA outputs, and vice-versa. Crossover frequency of the RCA outputs is determined by the frequency setting on the crossover. This makes it much easier to design multi-amplifier systems.
5 d8 h+ b M; F! w
/ |; |/ j4 L0 l, {* t% D! S/ n2 }" Q+ X. b u
Specifications
9 T7 ?% \0 q+ C0 m M6 Y2 m& E; r" E" C, ~
RMS Power measured at 12.5 Volts DC:
4 x$ A- y9 J: E/ S- {37.5 watts x 2 into a 4 ohm load with less than 0.05% THD+N8 F# b1 ]) w" Z" l! q
75 watts x 2 into a 2 ohm load with less than 0.1% THD+N
2 V' G4 j% }# \6 Q150 watts bridged into a 4 ohm load with less than 0.1% THD+N
" L3 h4 D3 g( R/ W( E7 k" ^
3 X h- J+ h/ c- P( M6 PDynamic Power (IHF-202 standard) measured at 14.4 Volts DC: - {4 T2 l* U1 t# r
90 watts x 2 into a 4 ohm load. |/ Y5 ?1 M% ?: X
165 watts x 2 into a 2 ohm load6 \! V& I. x9 Q: {
325 watts bridged into a 4 ohm load
6 t t: {* o7 }% F4 f2 @" u, s$ E% {% D) ?9 b* `1 N
Signal to Noise Ratio 5 w* `. |" v& t1 [/ h" }
> or = 110dB A-Weighted " |6 Y2 K6 c" D1 a2 i2 t6 d
7 x" ?7 A$ t: G9 X
Damping Factor: ) w5 \# U5 e& j. d3 e9 i) F
>200 8 G( Y7 t% N1 k4 h" A9 h" {
W" b! J! L$ T3 ]5 s wMaximum Input 5 ^6 V7 b z8 R! B5 H6 \- w" v
8 Vrms * j$ f% K: ?% ~+ p! f
: [! |% Z+ u8 i: I. _# }( k
Frequency Response ) U- q0 K% a' P! u+ X4 _
20Hz-20kHz ±0.25dB 5 G3 i; k6 A: Z. ^; F+ s( \$ s
, `* q/ g* E/ {- i* `
Bass EQ + K' @; f: a [
(0-18dB) centered at 45Hz ) F5 @ [. W1 e- X8 T( G
3 c) x; w* s2 Q7 g9 p8 a! q
Crossover
1 q: W# R3 K4 U/ W8 FVariable 40Hz to 175Hz
0 e" r; w+ V+ v: Z12-18dB/Octave# H. [2 ^! b6 H7 x, h
HP or LP configurable2 x% {4 ^( r/ D5 s1 G
/ T) _2 E& R' [7 \% A% C. @
Dimensions
2 c4 _, @- d; E# p& N" Z8" x 9" x 2" (20.3cm x 22.8cm x 5cm), ^+ H/ W: @2 s6 ~' S
9-1/4 Wide Including IsoFeet (23.5cm) |
|