|
|
| 1.Withthe efficient heat pipe arrangement,maximized the thermal distribution effects. | ![]() | ![]() |
| 2. Optimum fin structureto minimize air resistance intaken. | ![]() | ![]() |
| 3. Optimized fin pitch for axial Fan | ![]() | ![]() |
| 4.The air tunnel formed inside the stack-heatsink fins accelerates the airflow. | ![]() |
| 1. Applicable CPU | - Socket Standards: Intel Socket 775, 1366CPUs, AMD Socket AM2+/AM2 CPUs
- Thermal Design Power of CPU: Max 250 Watt
| ![]() |
| 2. Components | ![]()
|
- Heatsink- 1EA (BARAM)
- Smart Clip - 4EA (2 x 2EA)
- Fixing Bolts for Smart Clip - 5EA (4EA+spare 1EA)
- BackPlate - 1EA
- Fixing Bolts for Heatsink - 5EA (4EA+spare 1EA)
- Rubber Pad - 1EA (For LGA775, AM2,AM2+,AM3)
- Insulation Washer - 1Set (4EA+spare 4EA)
- Thermal Grease - 1EA
- Hand Nut - 5EA (4EA + spare 1EA)
- Fan wire clip - 4EA(2Set)
|
* Not included Fan (Have to buy 120mm FAn in addition).
| ![]() |
| 3. Specification | | Product Name | BARAM | | Dimension | 67 × 132 × 160 (L x W x H)mm | | Weight | 625g
| | Heatsink Material | Pure Copper, Aluminum | | Dissipation Area | 7,580 cm² |
|
Installation Condition| 1. Case | - Distance from motherboard to case side should be over 170mm.
- For the case which has an Air Guide, it may have an interference with the heatsink fin,
therefore install it with removing the Air Guide.
| ![]() |
| 2. Height of parts on motherboard | - For the case when any of the parts (chipset heatsink, RAM heatsink etc.) height is in excess of 53mm from the motherboard, it would not be able to be mounted. Please proceed with installation after checking these heights.
| ![]() |
How to InstallIntel LGA 1366
Intel LGA 775
AMD Socket AM2,3
测试结果:
http://item.taobao.com/auction/item_detail.jhtml?item_id=b06d4bfd79d2f58dd8d328d33284d93d&x_id=0db2
[/qq] |
|